| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX100-10FF1148I | Virtex-4 LX | 11.520,00 | -10,00 | 99840 | 4478976 | 768 | 1.14V ~ 1.26V | 표면 실장 | -40 °C ~ +100 °C (Industrial) | 1148-BBGA (FCBGA) | 1148-FCBGA |
XC4VLX100-10FF1148I: Industrial-Grade Logic Hub for Complex System Integration
그리고 XC4VLX100-10FF1148I is a high-density, mid-to-high range member of the Xilinx Virtex®-4 LX family. Built on the revolutionary 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is engineered for architects who require substantial logic capacity—110,592 Logic Cells—without the extreme power and thermal footprint of the LX160 or LX200 variants.
Designed for Industrial-grade (-40°C to +100°C) environments, this FPGA provides the reliability and timing stability necessary for mission-critical infrastructure, industrial automation, and ruggedized computing platforms.
Core Engineering Highlights
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Robust Logic-to-Memory Ratio: With 110,592 Logic Cells 그리고 4,320 Kb of Block RAM, the LX100 offers an ideal environment for implementing large-scale state machines, complex custom RTL, and multi-protocol bridging.
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Industrial Thermal Resilience: 그리고 -I rating ensures that the device maintains its -10 speed grade timing specifications even in high-heat industrial enclosures or unconditioned outdoor environments.
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Advanced I/O Flexibility: Housed in the FF1148 Flip-Chip BGA package, the device breaks out 768 User I/Os. This high pin count is critical for interfacing with wide parallel buses (DDR2/QDR) and numerous differential pairs (LVDS/HSTL/SSTL).
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XtremeDSP™ Hardware Acceleration: Integrated with 96 DSP48 slices, providing hard-coded arithmetic power for real-time signal processing, filtering, and 18×18 bit multiplications at frequencies up to 400MHz.
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Precision Clock Management: 특징 Digital Clock Managers (DCMs) for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across massive, multi-clock domain designs.
Technical Specification Matrix
| 기능 | 사양 |
| 논리 셀 | 110,592 |
| CLB Array | 12,480 |
| Total Block RAM | 4,320 Kb |
| DSP48 Slices | 96 |
| User I/Os | 768 |
| 속도 등급 | -10 |
| 온도 등급 | 산업용(-40°C ~ +100°C) |
| 패키지 | FF1148 (Flip-Chip BGA) |
Why Specify the LX100-10I?
1. Optimized Routing Slack
One of the major pain points in FPGA design is routing congestion. The LX100’s ASMBL architecture ensures that logic, memory, and DSP columns are interleaved, providing high routing transparency. Even at 80% utilization, this device maintains excellent timing closure characteristics.
2. Signal Integrity and Reliability
그리고 FF1148 Flip-Chip package is designed with a high density of power and ground pins to mitigate Simultaneous Switching Noise (SSN). In industrial applications where electrical noise is a concern, the signal integrity provided by this package is a critical safeguard.
3. Proven Longevity
The Virtex-4 family is a mature and highly stable platform. For projects with 10–15 year life cycles—such as medical imaging backplanes or power grid monitoring—the LX100-10I offers a proven track record of field reliability and a well-documented toolchain.
Ideal Applications
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Industrial Automation: High-speed robotics and multi-axis motion control.
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Telecommunications: Base station signal processing and localized switching.
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Medical Systems: Ultrasound beamforming and real-time image reconstruction.
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항공우주 및 방위: Ground support equipment and secure communication bridges.
