| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K70T-2FBG484E | Kintex-7 | 5.125,00 | -2,00 | 65,600 | 4976640 | 285 | 0,97 - 1,03 V (typisch 1,0 V) | Oberflächenmontage | 0 °C - 100 °C | FBG-484 (23×23 mm) | 484-FCB |
XC7K70T-2FBG484E
Hersteller: Xilinx
Logische Zellen: 70,400
Logische Schnitte: 11,000
Eingebettetes RAM (eRAM): 4.680 Kb (130 × 36Kb Block RAM)
Maximale Benutzer-E/A: 285
Paket: FBG484 (Flip-Chip BGA)
Geschwindigkeitsstufe: -2
Betriebstemperatur: Erweitert (0°C bis +100°C)
Spezifikationen
Erläuterung der Artikelnummern
This is an extended industrial temperature grade FPGA chip from Xilinx Kintex-7 family, fabricated on 28nm advanced process technology. Optimized for cost-effective medium-scale signal processing, industrial control and communication interface applications under wide temperature working conditions, it balances logic resources, power consumption and cost perfectly.
- XC7K70T: Kintex-7 series medium-density FPGA, T denotes thin-gate low-power variant
- -2: Speed Grade 2, mainstream balanced timing grade, enough timing margin for most industrial logic design, balances running frequency and power consumption
- FBG484: 484-ball flip-chip BGA package, compact outline for miniaturized device layout
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
On-Chip Hardware Resources
1. General Logic Resources
- Total Logic Cells: 70,800
- Slices: 11,060
- Flip-flops: 88,480
- Look-Up Tables (LUTs): 44,240
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic slices: 240 units, applied for FFT calculation, digital filtering, motor control algorithm and signal convolution operation
- Block RAM Capacity: 3,780 Kb, used for data cache, FIFO buffer and local parameter storage
- Distributed RAM: 1,188 Kb
3. Taktmanagement-Module
- 6 MMCM clock management tiles
- 6 PLL phase locked loops
Support multi-frequency clock generation, clock phase shifting and high-frequency jitter suppression to meet multi-module synchronous timing requirements
4. Serielle Hochgeschwindigkeits-Transceiver
- 8 GTX high-speed serial transceivers
Maximum line rate up to 6.6 Gbps, compatible with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet mainstream serial communication protocols
5. I/O and Monitoring Unit
- Total available user I/O pins: 285
I/O bank voltage configurable from 1.2V to 3.3V, supports LVCMOS, LVDS, HSTL and all universal differential signal standards
Built-in dual-channel 12-bit XADC analog monitor, real-time monitoring of die temperature, internal power voltages and external analog signals
Leistungseigenschaften
Nominal core supply voltage: 1.0V
Independent power domains for logic, memory and transceiver modules
Typical power consumption: 3W ~ 12W; passive heat dissipation can satisfy conventional industrial continuous operation
Packaging & SMT Specifications
- Package: 484-pin FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours once vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental standards
- Shipped and stored in anti-static trays for automated PCB mass production
Umweltverträglichkeit und Zuverlässigkeit
Stable continuous operation is available under wide temperature variation, vibration and moderate electromagnetic interference industrial environments. It supports bitstream encryption and SEU single-event upset error detection, with strong anti-interference performance for harsh field equipment.
Typische Anwendungsszenarien
- Industrial automation motion controllers, multi-axis servo drive main control boards
- Industrial Ethernet gateway, field bus protocol conversion modules
- Portable signal acquisition instruments, vibration and temperature monitoring terminals
- Small wireless communication baseband processing units
- Medical auxiliary equipment logic control and data preprocessing boards
- Wide-temperature industrial embedded core boards and algorithm verification platforms
