| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K70T-2FBG484E | Kintex-7 | 5.125,00 | -2,00 | 65,600 | 4976640 | 285 | 0,97 – 1,03 V (típico: 1,0 V) | Montaje en superficie | 0 °C — 100 °C | FBG-484 (23 × 23 mm) | 484-FCB |
XC7K70T-2FBG484E
Fabricante: Xilinx
Células lógicas: 70,400
Rebanadas lógicas: 11,000
RAM integrada (eRAM): 4.680 Kb (130 bloques de RAM de 36 Kb)
E/S máxima por usuario: 285
Paquete: FBG484 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Part Number Interpretation
This is an extended industrial temperature grade FPGA chip from Xilinx Kintex-7 family, fabricated on 28nm advanced process technology. Optimized for cost-effective medium-scale signal processing, industrial control and communication interface applications under wide temperature working conditions, it balances logic resources, power consumption and cost perfectly.
- XC7K70T: Kintex-7 series medium-density FPGA, T denotes thin-gate low-power variant
- -2: Speed Grade 2, mainstream balanced timing grade, enough timing margin for most industrial logic design, balances running frequency and power consumption
- FBG484: 484-ball flip-chip BGA package, compact outline for miniaturized device layout
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
On-Chip Hardware Resources
1. General Logic Resources
- Total Logic Cells: 70,800
- Slices: 11,060
- Flip-flops: 88,480
- Look-Up Tables (LUTs): 44,240
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic slices: 240 units, applied for FFT calculation, digital filtering, motor control algorithm and signal convolution operation
- Block RAM Capacity: 3,780 Kb, used for data cache, FIFO buffer and local parameter storage
- Distributed RAM: 1,188 Kb
3. Clock Management Modules
- 6 MMCM clock management tiles
- 6 PLL phase locked loops
Support multi-frequency clock generation, clock phase shifting and high-frequency jitter suppression to meet multi-module synchronous timing requirements
4. High-Speed Serial Transceivers
- 8 GTX high-speed serial transceivers
Maximum line rate up to 6.6 Gbps, compatible with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet mainstream serial communication protocols
5. I/O and Monitoring Unit
- Total available user I/O pins: 285
I/O bank voltage configurable from 1.2V to 3.3V, supports LVCMOS, LVDS, HSTL and all universal differential signal standards
Built-in dual-channel 12-bit XADC analog monitor, real-time monitoring of die temperature, internal power voltages and external analog signals
Power Characteristics
Nominal core supply voltage: 1.0V
Independent power domains for logic, memory and transceiver modules
Typical power consumption: 3W ~ 12W; passive heat dissipation can satisfy conventional industrial continuous operation
Packaging & SMT Specifications
- Package: 484-pin FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours once vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental standards
- Shipped and stored in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
Stable continuous operation is available under wide temperature variation, vibration and moderate electromagnetic interference industrial environments. It supports bitstream encryption and SEU single-event upset error detection, with strong anti-interference performance for harsh field equipment.
Escenarios típicos de aplicación
- Industrial automation motion controllers, multi-axis servo drive main control boards
- Industrial Ethernet gateway, field bus protocol conversion modules
- Portable signal acquisition instruments, vibration and temperature monitoring terminals
- Small wireless communication baseband processing units
- Medical auxiliary equipment logic control and data preprocessing boards
- Wide-temperature industrial embedded core boards and algorithm verification platforms
