| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K70T-2FBG484E | Kintex-7 | 5.125,00 | -2,00 | 65,600 | 4976640 | 285 | 0,97 – 1,03 V (thông thường 1,0 V) | Lắp đặt bề mặt | 0 °C — 100 °C | FBG-484 (23×23 mm) | 484-FCB |
XC7K70T-2FBG484E
Nhà sản xuất: Xilinx
Tế bào logic: 70,400
Các lát cắt logic: 11,000
Bộ nhớ RAM tích hợp (eRAM): 4.680 Kb (130 khối RAM 36 Kb)
Dung lượng I/O tối đa của người dùng: 285
Gói: FBG484 (BGA lật chip)
Đánh giá tốc độ: -2
Nhiệt độ hoạt động: Mở rộng (0°C đến +100°C)
Thông số kỹ thuật
Part Number Interpretation
This is an extended industrial temperature grade FPGA chip from Xilinx Kintex-7 family, fabricated on 28nm advanced process technology. Optimized for cost-effective medium-scale signal processing, industrial control and communication interface applications under wide temperature working conditions, it balances logic resources, power consumption and cost perfectly.
- XC7K70T: Kintex-7 series medium-density FPGA, T denotes thin-gate low-power variant
- -2: Speed Grade 2, mainstream balanced timing grade, enough timing margin for most industrial logic design, balances running frequency and power consumption
- FBG484: 484-ball flip-chip BGA package, compact outline for miniaturized device layout
- E: Dải nhiệt độ công nghiệp mở rộng, nhiệt độ điểm nối hoạt động: -40°C ~ +100°C
On-Chip Hardware Resources
1. General Logic Resources
- Total Logic Cells: 70,800
- Slices: 11,060
- Flip-flops: 88,480
- Look-Up Tables (LUTs): 44,240
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic slices: 240 units, applied for FFT calculation, digital filtering, motor control algorithm and signal convolution operation
- Block RAM Capacity: 3,780 Kb, used for data cache, FIFO buffer and local parameter storage
- Distributed RAM: 1,188 Kb
3. Các mô-đun quản lý đồng hồ
- 6 MMCM clock management tiles
- 6 PLL phase locked loops
Support multi-frequency clock generation, clock phase shifting and high-frequency jitter suppression to meet multi-module synchronous timing requirements
4. Bộ thu phát nối tiếp tốc độ cao
- 8 GTX high-speed serial transceivers
Maximum line rate up to 6.6 Gbps, compatible with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet mainstream serial communication protocols
5. I/O and Monitoring Unit
- Total available user I/O pins: 285
I/O bank voltage configurable from 1.2V to 3.3V, supports LVCMOS, LVDS, HSTL and all universal differential signal standards
Built-in dual-channel 12-bit XADC analog monitor, real-time monitoring of die temperature, internal power voltages and external analog signals
Power Characteristics
Nominal core supply voltage: 1.0V
Independent power domains for logic, memory and transceiver modules
Typical power consumption: 3W ~ 12W; passive heat dissipation can satisfy conventional industrial continuous operation
Packaging & SMT Specifications
- Package: 484-pin FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours once vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental standards
- Shipped and stored in anti-static trays for automated PCB mass production
Khả năng thích ứng với môi trường và độ tin cậy
Stable continuous operation is available under wide temperature variation, vibration and moderate electromagnetic interference industrial environments. It supports bitstream encryption and SEU single-event upset error detection, with strong anti-interference performance for harsh field equipment.
Các tình huống ứng dụng điển hình
- Industrial automation motion controllers, multi-axis servo drive main control boards
- Industrial Ethernet gateway, field bus protocol conversion modules
- Portable signal acquisition instruments, vibration and temperature monitoring terminals
- Small wireless communication baseband processing units
- Medical auxiliary equipment logic control and data preprocessing boards
- Wide-temperature industrial embedded core boards and algorithm verification platforms
