| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX330-1FFG1760C | Virtex-5 LX330 | 25.920,00 | -1,00 | 331776 | 10616832 | 1.200 | 0,95 V - 1,05 V | Oberflächenmontage | 0 °C ~ 85 °C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5 × 42.5 mm) |
XC5VLX330-1FFG1760C
Hersteller: Xilinx
Logische Zellen: 326,080
Logische Schnitte: 52,000
Eingebettetes RAM (eRAM): 13,440 Kb
Paket: FFG1760 (Flip-Chip BGA)
Betriebstemperatur: Handelsüblich (0°C bis +85°C)
Spezifikationen
The XC5VLX330-1FFG1760C is a high-density FPGA from Xilinx Virtex-5 series, designed for complex logic processing and high-speed embedded applications.
✔ Original & Compatible Available
✔ Fast Shipping Worldwide
✔ RFQ Response Within 12 Hours
🔥 Stock Status
- 32 pcs available
- Incoming: 120 pcs (2–3 weeks)
⚡ High demand – limited stock
Spezifikationen
- Manufacturer: Xilinx
- Series: Virtex-5
- Logic Cells: 331,776
- Package: FFG1760
- Geschwindigkeitsstufe: -1
- Temp Range: Commercial
- Core Voltage: 1.0V
Technical Description
The XC5VLX330 FPGA provides high logic density and advanced DSP capabilities, enabling efficient signal processing and scalable system design. It is widely used in telecom infrastructure, industrial automation, and embedded computing.
🔄 Cross Reference
- XC5VLX330-2FFG1760C
- XC5VLX330T-1FFG1738C
- XC5VLX220-1FFG1153C
- Kintex-7 XC7K325T
Anwendungen
- Data Communication
- Industrielle Steuerung
- Medical Imaging
- Aerospace Systems
📩 RFQ
Get best price & availability today →harriet@lxbchip.com
