XC5VLX330-1FFG1760C

Üretici firma: Xilinx
Mantık Hücreleri: 326,080
Mantık Dilimleri: 52,000
Gömülü RAM (eRAM): 13,440 Kb
Paket: FFG1760 (Flip-Chip BGA)
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC5VLX330-1FFG1760C Virtex-5 LX330 25.920,00 -1,00 331776 10616832 1.200 0,95 V - 1,05 V Yüzey Montajı 0 °C ~ 85 °C (TJ) 1760-BBGA, FCBGA 1760-FCBGA (42,5 × 42,5 mm)

    The XC5VLX330-1FFG1760C is a high-density FPGA from Xilinx Virtex-5 series, designed for complex logic processing and high-speed embedded applications.

    ✔ Original & Compatible Available
    ✔ Fast Shipping Worldwide
    ✔ RFQ Response Within 12 Hours


    🔥 Stock Status

    • 32 pcs available
    • Incoming: 120 pcs (2–3 weeks)
      ⚡ High demand – limited stock

    Teknik Özellikler

    • Manufacturer: Xilinx
    • Seri: Virtex-5
    • Logic Cells: 331,776
    • Package: FFG1760
    • Hız Derecesi: -1
    • Temp Range: Commercial
    • Core Voltage: 1.0V

    Technical Description

    The XC5VLX330 FPGA provides high logic density and advanced DSP capabilities, enabling efficient signal processing and scalable system design. It is widely used in telecom infrastructure, industrial automation, and embedded computing.


    🔄 Cross Reference

    • XC5VLX330-2FFG1760C
    • XC5VLX330T-1FFG1738C
    • XC5VLX220-1FFG1153C
    • Kintex-7 XC7K325T

    Uygulamalar

    • Data Communication
    • Endüstriyel Kontrol
    • Tıbbi Görüntüleme
    • Aerospace Systems

    📩 RFQ

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