XC5VFX70T-2FFG1136C

Hersteller: Xilinx
Logische Zellen: 71,680
Logische Schnitte: ~5,600
Eingebettetes RAM (eRAM): 5,456 Kb
Paket: FFG1136 (Flip?Chip BGA)
Betriebstemperatur: Handelsüblich (0°C bis +85°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC5VFX70T-2FFG1136C Virtex-5 FXT 5.600,00 -2,00 71680 5455872 640 0,95 V-1,05 V Oberflächenmontage 0 °C ~ +85 °C 1136-FBGA / FCBGA 1136-FCBGA (≈31×31 mm)

    XC5VFX70T-2FFG1136C – Xilinx Virtex-5 FXT FPGA

    Die XC5VFX70T-2FFG1136C is a mid-density FPGA from the Xilinx Virtex-5 FXT family, designed for systems that require embedded processing capability, high-speed serial connectivity, and reliable logic performance within a single device. At LXB Halbleiter, this part is commonly supplied for communication and embedded platforms operating in controlled environments, as well as for ongoing support of established Virtex-5–based designs.

    Logic Resources and Embedded Processing

    The XC5VFX70T provides approximately 70K logic cells, making it suitable for protocol handling, multi-interface control logic, and custom hardware functions. As an FXT-family device, it integrates dual PowerPC® 440 processors, allowing designers to run system control, management software, and real-time tasks directly inside the FPGA fabric.

    Die -2 Geschwindigkeitsstufe offers improved timing performance compared to lower speed grades, supporting higher internal clock frequencies and tighter timing margins for designs with moderate to demanding performance requirements.

    High-Speed Serial Connectivity

    This device includes RocketIO™ GTX-Transceiver, enabling direct support for high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating these interfaces on-chip, system designers can reduce external components and simplify high-speed PCB layouts.

    On-Chip Memory and System Integration

    Integrated Block-RAM resources support on-chip buffering, data queues, and local memory for the embedded processors. This helps reduce external memory access, improves latency control, and contributes to predictable system behavior in real-time applications.

    The Virtex-5 FXT platform is supported by a mature Xilinx toolchain and a broad ecosystem of proven IP cores, which remains valuable for long-life products and maintenance-focused projects.

    Package and Commercial Temperature Grade

    Die FFG1136 flip-chip BGA package provides a high pin count, enabling flexible I/O assignment and support for interface-dense board designs.
    Die commercial temperature grade (C) is intended for controlled operating environments such as indoor communication equipment, laboratory systems, and enterprise platforms.

    Typische Anwendungen

    The XC5VFX70T-2FFG1136C is commonly used in:

    • Telecommunications and networking equipment

    • Embedded processing platforms with hardware–software co-design

    • Test and measurement systems

    • High-speed data acquisition and interface cards

    • Legacy system upgrades and long-term production programs

    Although Virtex-5 is a mature FPGA family, the XC5VFX70T remains relevant due to its balanced logic capacity, integrated CPU architecture, and proven field reliability. For engineers maintaining existing FXT-based designs, it offers a stable, low-risk solution with predictable performance.