XC5V5VFX70T-2FFG1136C

الشركة المصنعة: زيلينكس
الخلايا المنطقية: 71,680
شرائح المنطق: ~5,600
ذاكرة الوصول العشوائي المدمجة (eRAM): 5,456 Kb
الحزمة: FFG1136 (Flip?Chip BGA)
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)

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    المواصفات

    الطراز P/N السلسلة عدد المعامل/المختبرات درجة السرعة عدد العناصر/الخلايا المنطقية إجمالي بتات ذاكرة الوصول العشوائي (RAM) عدد الإدخال/الإخراج الجهد - الإمداد نوع التركيب درجة حرارة التشغيل العبوة / العلبة حزمة جهاز المورد
    XC5V5VFX70T-2FFG1136C Virtex-5 FXT 5.600,00 -2,00 71680 5455872 640 0.95 فولت - 1.05 فولت التركيب على السطح 0 درجة مئوية ~ +85 درجة مئوية 1136-FBGA/FCBGA/1136 1136-FCBGA (≈31×31 مم)

    XC5VFX70T-2FFG1136C – Xilinx Virtex-5 FXT FPGA

    إن XC5V5VFX70T-2FFG1136C is a mid-density FPGA from the عائلة Xilinx Virtex-5 FXT من Xilinx, designed for systems that require embedded processing capability, high-speed serial connectivity, and reliable logic performance within a single device. At LXB Semicon, this part is commonly supplied for communication and embedded platforms operating in controlled environments, as well as for ongoing support of established Virtex-5–based designs.

    الموارد المنطقية والمعالجة المدمجة

    The XC5VFX70T provides approximately 70K logic cells, making it suitable for protocol handling, multi-interface control logic, and custom hardware functions. As an FXT-family device, it integrates معالجات PowerPC® 440 المزدوجة, allowing designers to run system control, management software, and real-time tasks directly inside the FPGA fabric.

    إن -2 درجة السرعة offers improved timing performance compared to lower speed grades, supporting higher internal clock frequencies and tighter timing margins for designs with moderate to demanding performance requirements.

    اتصال تسلسلي عالي السرعة

    يتضمن هذا الجهاز أجهزة الإرسال والاستقبال RocketIO™ GTX, enabling direct support for high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating these interfaces on-chip, system designers can reduce external components and simplify high-speed PCB layouts.

    On-Chip Memory and System Integration

    متكامل كتلة ذاكرة الوصول العشوائي (RAM) resources support on-chip buffering, data queues, and local memory for the embedded processors. This helps reduce external memory access, improves latency control, and contributes to predictable system behavior in real-time applications.

    The Virtex-5 FXT platform is supported by a mature Xilinx toolchain and a broad ecosystem of proven IP cores, which remains valuable for long-life products and maintenance-focused projects.

    Package and Commercial Temperature Grade

    إن FFG1136 flip-chip BGA package provides a high pin count, enabling flexible I/O assignment and support for interface-dense board designs.
    إن commercial temperature grade (C) is intended for controlled operating environments such as indoor communication equipment, laboratory systems, and enterprise platforms.

    التطبيقات النموذجية

    The XC5VFX70T-2FFG1136C is commonly used in:

    • Telecommunications and networking equipment

    • Embedded processing platforms with hardware–software co-design

    • Test and measurement systems

    • High-speed data acquisition and interface cards

    • Legacy system upgrades and long-term production programs

    Although Virtex-5 is a mature FPGA family, the XC5VFX70T remains relevant due to its balanced logic capacity, integrated CPU architecture, and proven field reliability. For engineers maintaining existing FXT-based designs, it offers a stable, low-risk solution with predictable performance.