| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX200T-1FFG1738I | Virtex-5 FXT | 15.360,00 | -1,00 | 196608 | 16809984 | 960 | 0,95 V-1,05 V | Oberflächenmontage | -40 °C ~ +100 °C | 1738-FBGA / FCBGA | 1738-FCBGA (≈42,5×42,5 mm) |
XC5VFX200T-1FFG1738I
Hersteller: Xilinx Logische Zellen: 200,704 Logische Schnitte: 31,200 Eingebettetes RAM (eRAM): 8,352 Kb (464 × 18Kb Block RAM) Paket: FFG1738 (Flip-Chip BGA) Betriebstemperatur: Industriell (-40°C bis +100°C)
Spezifikationen
Die XC5VFX200T-1FFG1738I is a high-density device from the Virtex-5 FXT lineup by Xilinx (now part of AMD). Built on a 65nm process, it combines substantial FPGA logic resources with embedded PowerPC 440 processing and high-speed RocketIO GTX serial transceivers.
- Around 196,608 logic cells — plenty of room for complex designs, DSP-heavy processing, or large state machines
- 24 RocketIO GTX transceivers — these support multi-gigabit rates, typically up to ~6.5 Gbps in real-world use cases
- 960 user I/Os — lots of flexible pins for connecting to external memory, ADCs, sensors, or backplanes
- Embedded block RAM totals about 16–17 Mbit (plus distributed RAM for smaller buffers)
- Built-in PowerPC 440 processor blocks — super useful if you want hard embedded CPU capability without adding an external chip
- Package: 1738-pin FCBGA (flip-chip, roughly 42.5 × 42.5 mm body), industrial temp range (-40°C to +100°C junction)
