XC5VFX200T-1FFG1738I

Produsen: Xilinx Sel Logika: 200,704 Irisan Logika: 31,200 RAM tertanam (eRAM): 8,352 Kb (464 × 18Kb Block RAM) Paket: FFG1738 (Flip-Chip BGA) Suhu Pengoperasian: Industri (-40°C hingga +100°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / N SERI JUMLAH LABORATORIUM/CLBS TINGKAT KECEPATAN JUMLAH ELEMEN / SEL LOGIKA TOTAL BIT RAM JUMLAH I / O TEGANGAN - PASOKAN JENIS PEMASANGAN SUHU PENGOPERASIAN PAKET / KASUS PAKET PERANGKAT PEMASOK
    XC5VFX200T-1FFG1738I Virtex-5 FXT 15.360,00 -1,00 196608 16809984 960 0,95 V-1,05 V Pemasangan di Permukaan -40 ° C ~ +100 ° C 1738-FBGA / FCBGA 1738-FCBGA (≈42,5 × 42,5 mm)

    The XC5VFX200T-1FFG1738I is a high-density device from the Virtex-5 FXT lineup by Xilinx (now part of AMD). Built on a 65nm process, it combines substantial FPGA logic resources with embedded PowerPC 440 processing and high-speed RocketIO GTX serial transceivers.

    • Around 196,608 logic cells — plenty of room for complex designs, DSP-heavy processing, or large state machines
    • 24 RocketIO GTX transceivers — these support multi-gigabit rates, typically up to ~6.5 Gbps in real-world use cases
    • 960 user I/Os — lots of flexible pins for connecting to external memory, ADCs, sensors, or backplanes
    • Embedded block RAM totals about 16–17 Mbit (plus distributed RAM for smaller buffers)
    • Built-in PowerPC 440 processor blocks — super useful if you want hard embedded CPU capability without adding an external chip
    • Package: 1738-pin FCBGA (flip-chip, roughly 42.5 × 42.5 mm body), industrial temp range (-40°C to +100°C junction)