XC5VFX200T-1FFG1738I

제조업체: 자일링스 로직 셀: 200,704 로직 슬라이스: 31,200 임베디드 RAM(eRAM): 8,352 Kb (464 × 18Kb Block RAM) 패키지: FFG1738(플립칩 BGA) 작동 온도: 산업용(-40°C ~ +100°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC5VFX200T-1FFG1738I Virtex-5 FXT 15.360,00 -1,00 196608 16809984 960 0.95V-1.05V 표면 실장 -40°C ~ +100°C 1738-FBGA/FCBGA 1738-FCBGA (≈42.5×42.5 mm)

    그리고 XC5VFX200T-1FFG1738I is a high-density device from the Virtex-5 FXT lineup by 자일링스 (now part of AMD). Built on a 65nm process, it combines substantial FPGA logic resources with embedded PowerPC 440 processing and high-speed RocketIO GTX serial transceivers.

    • Around 196,608 logic cells — plenty of room for complex designs, DSP-heavy processing, or large state machines
    • 24 RocketIO GTX transceivers — these support multi-gigabit rates, typically up to ~6.5 Gbps in real-world use cases
    • 960 user I/Os — lots of flexible pins for connecting to external memory, ADCs, sensors, or backplanes
    • Embedded block RAM totals about 16–17 Mbit (plus distributed RAM for smaller buffers)
    • Built-in PowerPC 440 processor blocks — super useful if you want hard embedded CPU capability without adding an external chip
    • Package: 1738-pin FCBGA (flip-chip, roughly 42.5 × 42.5 mm body), industrial temp range (-40°C to +100°C junction)