| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-2FFG1738I | Virtex-5 FXT | 10.240,00 | -2,00 | 131072 | 10985472 | 840 | 0,95 V-1,05 V | Oberflächenmontage | -40 °C ~ +100 °C | 1738-FBGA, FCBGA | 1738-FCPBGA (42,5×42,5 mm) |
XC5VFX130T-2FFG1738I – Xilinx Virtex-5 FXT FPGA
Die XC5VFX130T-2FFG1738I is a high-end device in the Xilinx Virtex-5 FXT FPGA family, designed for systems that require large logic capacity, embedded processing, and high-speed serial communication in a single platform. At LXB Halbleiter, this part is commonly supplied for industrial and telecommunications projects where performance margins, platform stability, and long-term support are key design considerations.
Logic Capacity and Embedded Processing
With approximately 130K logic cells, the XC5VFX130T offers substantial resources for complex datapaths, multi-channel data processing, and hardware acceleration. A core advantage of the FXT family is the integration of dual PowerPC® 440 processors, enabling hardware-software co-design directly within the FPGA.
This architecture allows designers to handle real-time control, protocol processing, and system management internally, reducing latency and minimizing the need for external processors.
Die -2 Geschwindigkeitsstufe provides improved timing performance and higher achievable clock frequencies compared to lower speed grades, making this device suitable for designs with tighter timing requirements and high data throughput.
High-Speed Serial Transceivers
The XC5VFX130T integrates RocketIO™ GTX-Transceiver, supporting high-speed serial interfaces such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and custom point-to-point links. This level of integration helps simplify board design and improves overall signal integrity in high-bandwidth systems.
On-Chip Memory and System Integration
A significant amount of Block-RAM is available for buffering, packet queues, and local memory storage for embedded processors. This reduces dependence on external memory, improves determinism, and supports consistent low-latency operation in real-time systems.
The Virtex-5 FXT platform benefits from a mature and well-documented Xilinx toolchain, along with a wide range of proven IP cores, which is especially valuable for long-life and maintenance-driven projects.
Package and Industrial Temperature Rating
Die FFG1738 flip-chip BGA package provides a very high pin count, allowing flexible I/O allocation and support for interface-dense designs.
Die industrial temperature grade (I) ensures reliable operation across extended temperature ranges, making this FPGA suitable for industrial automation, outdoor communication equipment, and other harsh-environment applications.
