XC5VFX130T-2FFG1738I

제조업체: 자일링스 로직 셀: 130,560 로직 슬라이스: 20,480 임베디드 RAM(eRAM): 6,048Kb(336 × 18Kb 블록 RAM) 패키지: FFG1738(플립칩 BGA) 작동 온도: 산업용(-40°C ~ +100°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC5VFX130T-2FFG1738I Virtex-5 FXT 10.240,00 -2,00 131072 10985472 840 0.95V-1.05V 표면 실장 -40°C ~ +100°C 1738-FBGA, FCBGA 1738-FCPBGA(42.5×42.5mm)

    XC5VFX130T-2FFG1738I – Xilinx Virtex-5 FXT FPGA

    그리고 XC5VFX130T-2FFG1738I is a high-end device in the Xilinx Virtex-5 FXT FPGA family, 다음이 필요한 시스템을 위해 설계되었습니다. large logic capacity, embedded processing, and high-speed serial communication in a single platform. At LXB 세미콘, this part is commonly supplied for industrial and telecommunications projects where performance margins, platform stability, and long-term support are key design considerations.

    Logic Capacity and Embedded Processing

    With approximately 130K logic cells, the XC5VFX130T offers substantial resources for complex datapaths, multi-channel data processing, and hardware acceleration. A core advantage of the FXT family is the integration of 듀얼 PowerPC® 440 프로세서, enabling hardware-software co-design directly within the FPGA.

    This architecture allows designers to handle real-time control, protocol processing, and system management internally, reducing latency and minimizing the need for external processors.

    그리고 속도 등급 -2 provides improved timing performance and higher achievable clock frequencies compared to lower speed grades, making this device suitable for designs with tighter timing requirements and high data throughput.

    고속 직렬 트랜시버

    The XC5VFX130T integrates RocketIO™ GTX 트랜시버, supporting high-speed serial interfaces such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and custom point-to-point links. This level of integration helps simplify board design and improves overall signal integrity in high-bandwidth systems.

    온칩 메모리 및 시스템 통합

    A significant amount of 블록 RAM is available for buffering, packet queues, and local memory storage for embedded processors. This reduces dependence on external memory, improves determinism, and supports consistent low-latency operation in real-time systems.

    The Virtex-5 FXT platform benefits from a mature and well-documented Xilinx toolchain, along with a wide range of proven IP cores, which is especially valuable for long-life and maintenance-driven projects.

    Package and Industrial Temperature Rating

    그리고 FFG1738 flip-chip BGA package provides a very high pin count, allowing flexible I/O allocation and support for interface-dense designs.
    그리고 산업용 온도 등급(I) ensures reliable operation across extended temperature ranges, making this FPGA suitable for industrial automation, outdoor communication equipment, and other harsh-environment applications.