XC4VLX100-11FF1148I

Hersteller: Xilinx
Logische Zellen: 110,592
Logische Schnitte: 49,152 (approx)
Eingebettetes RAM (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Paket: FFG1148 (Flip-Chip BGA)
Betriebstemperatur: Industriell (-40°C bis +100°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC4VLX100-11FF1148I Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Oberflächenmontage -40 °C ~ +100 °C (industriell) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FF1148I: High-Performance Industrial FPGA for Zero-Latency Logic Systems

    Die XC4VLX100-11FF1148I is a high-speed, high-density FPGA engineered for mission-critical industrial applications. Utilizing Xilinx’s ASMBL™ (Advanced Silicon Modular Block) architecture, this device delivers an impressive 110,592 Logic Cells with the premium -11 speed grade. It is the go-to solution for engineers who need significant logic headroom and tight timing margins in environments where temperatures fluctuate between -40°C and +100°C.

    Housed in the FF1148 Flip-Chip BGA package, this FPGA provides a massive I/O throughput, making it a “heavyweight” choice for high-speed signal processing and complex system-level integration.

    Engineering Core Highlights

    • Premium -11 Speed Grade: The faster switching fabric of the -11 grade is essential for high-frequency designs (300MHz+). It provides the critical timing slack needed to achieve closure on complex, multi-level logic paths that would struggle on standard -10 grade parts.

    • Industrial Thermal Resilience: Die Industriell (-I) rating ensures that the device maintains its performance specifications across a wide thermal envelope. This is vital for outdoor telecommunications infrastructure and deep-floor industrial automation where active cooling may be inconsistent.

    • Massive I/O Throughput: Die FF1148 package breaks out 768 User I/Os. Leveraging SelectIO™ technology, this allows for massive parallel data handling, easily supporting high-width memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ Hardware Acceleration: Integrated with 96 DSP48 slices. These hard-coded blocks handle arithmetic-intensive tasks—such as FFTs and digital filtering—at hardware speeds, freeing up standard logic for control plane tasks.

    • Balanced Memory Architecture: Eigenschaften 4,320 Kb of Block RAM, optimized for low-latency data buffering and high-speed FIFO implementations required in real-time streaming applications.


    Technical Specification Matrix

    Merkmal Spezifikation
    Logische Zellen 110,592
    Configurable Logic Blocks (CLBs) 12,480
    Total Block RAM 4.320 Kb
    DSP48 Slices 96
    Maximum User I/O 768
    Geschwindigkeitsstufe -11 (High Performance)
    Temperatur Grad Industriell (-40°C bis +100°C)
    Paket FF1148 (Flip-Chip BGA)

    Why Specify the LX100-11I?

    1. Reliability in High-Utilization Designs

    When logic utilization exceeds 75%, routing congestion often causes timing failures. The combination of the ASMBL architecture and the -11 speed grade mitigates this risk, ensuring that your critical paths meet setup and hold requirements even in high-utilization scenarios.

    2. Superior Signal Integrity

    The Flip-Chip (FF) packaging is engineered to minimize parasitic inductance. In industrial settings where EMI/EMC compliance is non-negotiable, the LX100-11I provides the clean signal eyes and low ground bounce necessary for robust system operation.

    3. Long-Term Availability for Mission-Critical Gear

    The Virtex-4 LX100 is a mature, field-proven architecture. For projects requiring a 10+ year service life—such as medical imaging backplanes or power grid monitoring—this device offers a predictable and stable platform with a well-documented toolchain.


    Anwendungen

    • Luft- und Raumfahrt & Verteidigung: Ground-based radar signal processing and secure communication bridges.

    • Industrial Automation: High-precision multi-axis motion control and robotics.

    • Medical Systems: Real-time data acquisition for CT scanners and MRI reconstruction.

    • Vernetzung: High-speed protocol conversion and localized switching fabrics.