| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx100-11ff111148i | Virtex-4 LX | 11.520,00 | -11,00 | 99840 | 4478976 | 768 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | -40 °C ~ +100 °C (Industrial) | 1148-BBGA (FCBGA) | 1148-FCBGA |
XC4VLX100-11FF1148I: High-Performance Industrial FPGA for Zero-Latency Logic Systems
إن xc4vlx100-11ff111148i is a high-speed, high-density FPGA engineered for mission-critical industrial applications. Utilizing Xilinx’s ASMBL™ (Advanced Silicon Modular Block) architecture, this device delivers an impressive 110,592 Logic Cells with the premium -11 speed grade. It is the go-to solution for engineers who need significant logic headroom and tight timing margins in environments where temperatures fluctuate between -40°C and +100°C.
Housed in the FF1148 Flip-Chip BGA package, this FPGA provides a massive I/O throughput, making it a “heavyweight” choice for high-speed signal processing and complex system-level integration.
Engineering Core Highlights
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Premium -11 Speed Grade: The faster switching fabric of the -11 grade is essential for high-frequency designs (300MHz+). It provides the critical timing slack needed to achieve closure on complex, multi-level logic paths that would struggle on standard -10 grade parts.
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Industrial Thermal Resilience: إن صناعي (-I) rating ensures that the device maintains its performance specifications across a wide thermal envelope. This is vital for outdoor telecommunications infrastructure and deep-floor industrial automation where active cooling may be inconsistent.
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Massive I/O Throughput: إن FF1148 package breaks out 768 User I/Os. Leveraging SelectIO™ technology, this allows for massive parallel data handling, easily supporting high-width memory interfaces like DDR2 and QDR-II.
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XtremeDSP™ Hardware Acceleration: Integrated with 96 DSP48 slices. These hard-coded blocks handle arithmetic-intensive tasks—such as FFTs and digital filtering—at hardware speeds, freeing up standard logic for control plane tasks.
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Balanced Memory Architecture: الميزات 4,320 Kb of Block RAM, optimized for low-latency data buffering and high-speed FIFO implementations required in real-time streaming applications.
Technical Specification Matrix
| الميزة | المواصفات |
| الخلايا المنطقية | 110,592 |
| Configurable Logic Blocks (CLBs) | 12,480 |
| Total Block RAM | 4,320 Kb |
| DSP48 Slices | 96 |
| Maximum User I/O | 768 |
| درجة السرعة | -11 (High Performance) |
| درجة الحرارة | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) |
| الحزمة | FF1148 (Flip-Chip BGA) |
Why Specify the LX100-11I?
1. Reliability in High-Utilization Designs
When logic utilization exceeds 75%, routing congestion often causes timing failures. The combination of the ASMBL architecture and the -11 speed grade mitigates this risk, ensuring that your critical paths meet setup and hold requirements even in high-utilization scenarios.
2. Superior Signal Integrity
The Flip-Chip (FF) packaging is engineered to minimize parasitic inductance. In industrial settings where EMI/EMC compliance is non-negotiable, the LX100-11I provides the clean signal eyes and low ground bounce necessary for robust system operation.
3. Long-Term Availability for Mission-Critical Gear
The Virtex-4 LX100 is a mature, field-proven architecture. For projects requiring a 10+ year service life—such as medical imaging backplanes or power grid monitoring—this device offers a predictable and stable platform with a well-documented toolchain.
التطبيقات
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الطيران والفضاء والدفاع: Ground-based radar signal processing and secure communication bridges.
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Industrial Automation: High-precision multi-axis motion control and robotics.
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Medical Systems: Real-time data acquisition for CT scanners and MRI reconstruction.
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الربط الشبكي: High-speed protocol conversion and localized switching fabrics.
