XC4VLX100-11FF1148I

제조업체: 자일링스
로직 셀: 110,592
로직 슬라이스: 49,152(약)
임베디드 RAM(eRAM): 4,320Kb(240 × 18Kb 블록 RAM)
패키지: FFG1148(플립칩 BGA)
작동 온도: 산업용(-40°C ~ +100°C)

메시지 보내기

    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC4VLX100-11FF1148I Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1.14V ~ 1.26V 표면 실장 -40°C ~ +100°C(산업용) 1148-BBGA(FCBGA) 1148-FCBGA

    XC4VLX100-11FF1148I: High-Performance Industrial FPGA for Zero-Latency Logic Systems

    그리고 XC4VLX100-11FF1148I is a high-speed, high-density FPGA engineered for mission-critical industrial applications. Utilizing Xilinx’s ASMBL™ (Advanced Silicon Modular Block) architecture, this device delivers an impressive 110,592 로직 셀 with the premium -11 속도 등급. It is the go-to solution for engineers who need significant logic headroom and tight timing margins in environments where temperatures fluctuate between -40°C and +100°C.

    에 보관되어 있습니다. FF1148 플립칩 BGA package, this FPGA provides a massive I/O throughput, making it a “heavyweight” choice for high-speed signal processing and complex system-level integration.

    Engineering Core Highlights

    • Premium -11 Speed Grade: The faster switching fabric of the -11 grade is essential for high-frequency designs (300MHz+). It provides the critical timing slack needed to achieve closure on complex, multi-level logic paths that would struggle on standard -10 grade parts.

    • 산업용 열 복원력: 그리고 산업용(-I) rating ensures that the device maintains its performance specifications across a wide thermal envelope. This is vital for outdoor telecommunications infrastructure and deep-floor industrial automation where active cooling may be inconsistent.

    • Massive I/O Throughput: 그리고 FF1148 패키지 브레이크 아웃 768 사용자 I/O. Leveraging SelectIO™ 기술, this allows for massive parallel data handling, easily supporting high-width memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ 하드웨어 가속: 다음과 통합 96개의 DSP48 슬라이스. These hard-coded blocks handle arithmetic-intensive tasks—such as FFTs and digital filtering—at hardware speeds, freeing up standard logic for control plane tasks.

    • Balanced Memory Architecture: 특징 4,320Kb의 블록 RAM, optimized for low-latency data buffering and high-speed FIFO implementations required in real-time streaming applications.


    기술 사양 매트릭스

    기능 사양
    논리 셀 110,592
    구성 가능한 로직 블록(CLB) 12,480
    총 블록 RAM 4,320 Kb
    DSP48 슬라이스 96
    최대 사용자 I/O 768
    속도 등급 -11(고성능)
    온도 등급 산업용(-40°C ~ +100°C)
    패키지 FF1148(플립칩 BGA)

    Why Specify the LX100-11I?

    1. Reliability in High-Utilization Designs

    When logic utilization exceeds 75%, routing congestion often causes timing failures. The combination of the ASMBL architecture and the -11 속도 등급 mitigates this risk, ensuring that your critical paths meet setup and hold requirements even in high-utilization scenarios.

    2. 뛰어난 신호 무결성

    The Flip-Chip (FF) packaging is engineered to minimize parasitic inductance. In industrial settings where EMI/EMC compliance is non-negotiable, the LX100-11I provides the clean signal eyes and low ground bounce necessary for robust system operation.

    3. Long-Term Availability for Mission-Critical Gear

    The Virtex-4 LX100 is a mature, field-proven architecture. For projects requiring a 10+ year service life—such as medical imaging backplanes or power grid monitoring—this device offers a predictable and stable platform with a well-documented toolchain.


    애플리케이션

    • 항공우주 및 방위: Ground-based radar signal processing and secure communication bridges.

    • 산업 자동화: High-precision multi-axis motion control and robotics.

    • 의료 시스템: Real-time data acquisition for CT scanners and MRI reconstruction.

    • 네트워킹: 고속 프로토콜 변환 및 현지화된 스위칭 패브릭.