XC4VLX100-10FFG1148I

Hersteller: Xilinx
Logische Zellen: 110,592
Logische Schnitte: 49.152 (ungefähr)
Eingebettetes RAM (eRAM): 4.320 Kb (240 × 18Kb Block RAM)
Paket: FFG1148 (Flip-Chip BGA)
Betriebstemperatur: Industriell (-40°C bis +100°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC4VLX100-10FFG1148I Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1,14 V ~ 1,26 V Oberflächenmontage -40 °C ~ +100 °C (industriell) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FFG1148I: High-Density Industrial FPGA for Robust System Logic

    Die XC4VLX100-10FFG1148I is a high-performance, industrial-grade FPGA member of the Xilinx Virtex®-4 LX family. Built on the innovative 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is specifically engineered for designers who require a massive logic fabric—110.592 Logik-Zellen—without moving to the extreme power envelopes of the LX160 or LX200 variants.

    Untergebracht im FFG1148 Lead-Free Flip-Chip BGA package, this device is binned for Industrial-grade (-40°C to +100°C) operation, ensuring timing stability and long-term reliability in the most demanding environmental conditions.

    Kerntechnische Highlights

    • Logic Capacity & Scalability: Mit 110.592 Logik-Zellen and over 12,000 CLBs, the LX100 provides the “headroom” necessary to consolidate multiple IP cores, custom state machines, and high-speed protocol bridges into a single chip.

    • Industrial Thermal Resilience: Die “-I” rating ensures that the FPGA maintains its -10 speed grade timing characteristics across a wide temperature spectrum. This is a critical requirement for outdoor telecommunications infrastructure and ruggedized industrial automation.

    • Massive I/O Density: Die FFG1148 package stellt aus. 768 Benutzer-E/As. Leveraging Xilinx’s SelectIO™ technology, it supports an extensive array of differential (LVDS) and single-ended (HSTL/SSTL) signaling standards, ideal for interfacing with high-width DDR2 or QDR memory banks.

    • Dedicated DSP Power: Integrated with 96 DSP48-Scheiben. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, enabling real-time signal processing and filtering without exhausting general logic fabric.

    • Optimierte Speicherhierarchie: Eigenschaften 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput data streams.


    Matrix der technischen Spezifikationen

    Merkmal Spezifikation
    Logische Zellen 110,592
    Block-RAM insgesamt 4.320 Kb
    DSP48-Scheiben 96
    Benutzer E/As 768
    Geschwindigkeitsstufe -10
    Betriebstemperatur Industriell (-40°C bis +100°C Tj)
    Paket FFG1148 (Lead-Free / 1.0mm Pitch)
    Kernspannung 1.2V

    Why Specify the LX100-10I?

    1. Predictable Timing Closure

    The ASMBL architecture interleaves logic, memory, and DSP columns, which significantly reduces routing congestion. For engineers working on designs with >80% logic utilization, the LX100-10I offers much more predictable timing closure compared to less advanced architectures.

    2. Superior Signal Integrity

    Die FFG1148 Flip-Chip package is specifically designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Gleichzeitiges Umschaltrauschen (SSN), which is vital for maintaining robust noise margins in high-speed parallel bus designs.

    3. Long-Lifecycle Stability

    The Virtex-4 series remains a cornerstone for high-reliability systems with 10–15 year service requirements. Choosing the LX100-10I provides a proven, well-documented platform with a stable toolchain, reducing the risk of mid-lifecycle architectural bugs.


    Primäre Anwendungen

    • Industrielle Steuerung: Multi-axis robotics and high-precision motor control.

    • Telekommunikation: Base station signal processing and localized switching.

    • Medical Equipment: Real-time data acquisition for CT/MRI reconstruction backends.

    • Verteidigung und Luft- und Raumfahrt: Ground support systems and secure communication bridges.