XC4VLX100-10FFG1148I

Produsen: Xilinx
Sel Logika: 110,592
Irisan Logika: 49.152 (sekitar)
RAM tertanam (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FFG1148 (Flip-Chip BGA)
Suhu Pengoperasian: Industri (-40°C hingga +100°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / N SERI JUMLAH LABORATORIUM/CLBS TINGKAT KECEPATAN JUMLAH ELEMEN / SEL LOGIKA TOTAL BIT RAM JUMLAH I / O TEGANGAN - PASOKAN JENIS PEMASANGAN SUHU PENGOPERASIAN PAKET / KASUS PAKET PERANGKAT PEMASOK
    XC4VLX100-10FFG1148I Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1,14 V ~ 1,26 V Pemasangan di Permukaan -40 ° C ~ +100 ° C (Industri) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FFG1148I: High-Density Industrial FPGA for Robust System Logic

    The XC4VLX100-10FFG1148I is a high-performance, industrial-grade FPGA member of the Xilinx Virtex®-4 LX family. Built on the innovative 90nm ASMBL™ (Blok Modular Silikon Tingkat Lanjut) architecture, this device is specifically engineered for designers who require a massive logic fabric—110,592 Logic Cells—without moving to the extreme power envelopes of the LX160 or LX200 variants.

    Bertempat di FFG1148 BGA Flip-Chip Bebas Timbal package, this device is binned for Industrial-grade (-40°C to +100°C) operation, ensuring timing stability and long-term reliability in the most demanding environmental conditions.

    Sorotan Rekayasa Inti

    • Logic Capacity & Scalability: Dengan 110,592 Logic Cells and over 12,000 CLBs, the LX100 provides the “headroom” necessary to consolidate multiple IP cores, custom state machines, and high-speed protocol bridges into a single chip.

    • Industrial Thermal Resilience: The “-I” rating ensures that the FPGA maintains its -10 speed grade timing characteristics across a wide temperature spectrum. This is a critical requirement for outdoor telecommunications infrastructure and ruggedized industrial automation.

    • Massive I/O Density: The Paket FFG1148 exposes 768 I/O Pengguna. Leveraging Xilinx’s SelectIO™ technology, it supports an extensive array of differential (LVDS) and single-ended (HSTL/SSTL) signaling standards, ideal for interfacing with high-width DDR2 or QDR memory banks.

    • Dedicated DSP Power: Terintegrasi dengan 96 irisan DSP48. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, enabling real-time signal processing and filtering without exhausting general logic fabric.

    • Hirarki Memori yang Dioptimalkan: Fitur 4.320 Kb RAM Blok (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput data streams.


    Matriks Spesifikasi Teknis

    Fitur Spesifikasi
    Sel Logika 110,592
    Total Blok RAM 4.320 Kb
    Irisan DSP48 96
    I / O Pengguna 768
    Tingkat Kecepatan -10
    Suhu Pengoperasian Industri (-40°C hingga +100°C Tj)
    Paket FFG1148 (Lead-Free / 1.0mm Pitch)
    Tegangan Inti 1.2V

    Why Specify the LX100-10I?

    1. Penutupan Waktu yang Dapat Diprediksi

    The ASMBL architecture interleaves logic, memory, and DSP columns, which significantly reduces routing congestion. For engineers working on designs with >80% logic utilization, the LX100-10I offers much more predictable timing closure compared to less advanced architectures.

    2. Integritas Sinyal yang Unggul

    The FFG1148 Flip-Chip package is specifically designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Kebisingan Peralihan Serentak (SSN), which is vital for maintaining robust noise margins in high-speed parallel bus designs.

    3. Long-Lifecycle Stability

    The Virtex-4 series remains a cornerstone for high-reliability systems with 10–15 year service requirements. Choosing the LX100-10I provides a proven, well-documented platform with a stable toolchain, reducing the risk of mid-lifecycle architectural bugs.


    Primary Applications

    • Kontrol Industri: Multi-axis robotics and high-precision motor control.

    • Telekomunikasi: Base station signal processing and localized switching.

    • Medical Equipment: Real-time data acquisition for CT/MRI reconstruction backends.

    • Defense & Aerospace: Ground support systems and secure communication bridges.