XC4VLX100-10FFG1148I

Производитель: Xilinx
Логические ячейки: 110,592
Логические срезы: 49,152 (approx)
Встроенная оперативная память (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Упаковка: FFG1148 (Flip-Chip BGA)
Рабочая температура: Промышленные (от -40°C до +100°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC4VLX100-10FFG1148I Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1,14 V ~ 1,26 V Монтаж на поверхность -40 °C ~ +100 °C (промышленный) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FFG1148I: High-Density Industrial FPGA for Robust System Logic

    Сайт XC4VLX100-10FFG1148I is a high-performance, industrial-grade FPGA member of the Xilinx Virtex®-4 LX family. Built on the innovative 90 нм ASMBL™ (усовершенствованный кремниевый модульный блок) architecture, this device is specifically engineered for designers who require a massive logic fabric—110,592 Logic Cells—without moving to the extreme power envelopes of the LX160 or LX200 variants.

    Размещается в FFG1148 Lead-Free Flip-Chip BGA package, this device is binned for Industrial-grade (-40°C to +100°C) operation, ensuring timing stability and long-term reliability in the most demanding environmental conditions.

    Core Engineering Highlights

    • Logic Capacity & Scalability: С 110,592 Logic Cells and over 12,000 CLBs, the LX100 provides the “headroom” necessary to consolidate multiple IP cores, custom state machines, and high-speed protocol bridges into a single chip.

    • Industrial Thermal Resilience: Сайт “-I” rating ensures that the FPGA maintains its -10 speed grade timing characteristics across a wide temperature spectrum. This is a critical requirement for outdoor telecommunications infrastructure and ruggedized industrial automation.

    • Massive I/O Density: Сайт Упаковка FFG1148 exposes 768 User I/Os. Leveraging Xilinx’s SelectIO™ technology, it supports an extensive array of differential (LVDS) and single-ended (HSTL/SSTL) signaling standards, ideal for interfacing with high-width DDR2 or QDR memory banks.

    • Выделенная мощность DSP: Интеграция с 96 DSP48 slices. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, enabling real-time signal processing and filtering without exhausting general logic fabric.

    • Optimized Memory Hierarchy: Характеристики 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput data streams.


    Матрица технических характеристик

    Характеристика Технические характеристики
    Логические ячейки 110,592
    Всего блоков оперативной памяти 4 320 Кб
    Ломтики DSP48 96
    Пользовательские входы/выходы 768
    Степень скорости -10
    Рабочая температура Industrial (-40°C to +100°C Tj)
    Пакет FFG1148 (Lead-Free / 1.0mm Pitch)
    Напряжение сердечника 1.2V

    Why Specify the LX100-10I?

    1. Predictable Timing Closure

    The ASMBL architecture interleaves logic, memory, and DSP columns, which significantly reduces routing congestion. For engineers working on designs with >80% logic utilization, the LX100-10I offers much more predictable timing closure compared to less advanced architectures.

    2. Superior Signal Integrity

    Сайт FFG1148 Flip-Chip package is specifically designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Simultaneous Switching Noise (SSN), which is vital for maintaining robust noise margins in high-speed parallel bus designs.

    3. Long-Lifecycle Stability

    The Virtex-4 series remains a cornerstone for high-reliability systems with 10–15 year service requirements. Choosing the LX100-10I provides a proven, well-documented platform with a stable toolchain, reducing the risk of mid-lifecycle architectural bugs.


    Основные приложения

    • Промышленный контроль: Multi-axis robotics and high-precision motor control.

    • Telecommunications: Base station signal processing and localized switching.

    • Medical Equipment: Real-time data acquisition for CT/MRI reconstruction backends.

    • Defense & Aerospace: Ground support systems and secure communication bridges.