XCVU190-2FLGA2577I

Manufacturer: Xilinx
Logic Cells: 2,100,000
Logic Slices: 328,000
Embedded RAM (eRAM): 75,960 Kb (2,110 × 36Kb Block RAM)
Maximum User I/O: 900
Package: FLGA2577 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCVU190-2FLGA2577IVirtex® UltraScale134,28-2,002,349,900 LE150,937,600 bits4480.922–0.979 VSMD / FBGA-40°C ~ +100°CFBGA-25772577-FCBGA