| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU190-2FLGA2577I | Virtex® UltraScale | 134,28 | -2,00 | 2 349 900 LE | 150 937 600 bits | 448 | 0,922–0,979 V | SMD / FBGA | -40 °C ~ +100 °C | FBGA-2577 | 2577-FCBGA |
XCVU190-2FLGA2577I
Fabricante: Xilinx
Células lógicas: 2,100,000
Rebanadas lógicas: 328,000
RAM integrada (eRAM): 75 960 Kb (2110 bloques de RAM de 36 Kb)
E/S máxima por usuario: 900
Paquete: FLGA2577 (BGA de chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Industrial (-40°C a +100°C)
Especificaciones
Definición del número de pieza
This industrial temperature grade high-performance FPGA belongs to Xilinx Virtex UltraScale product line, built on 20nm FinFET manufacturing process. It features balanced logic scale, abundant high-speed transceivers and ample embedded computing resources, designed for aerospace signal processing, high-end communication equipment, hardware chip verification and rugged industrial embedded systems requiring reliable operation across wide temperature ranges.
- XCVU190: Mid-to-high capacity model within Virtex UltraScale series, equipped with complete high-speed serial interconnection architecture and moderate logic resource allocation
- -2: Speed Grade 2, mainstream high-speed timing grade. It delivers superior maximum operating frequency and stable timing closure performance for high-frequency complex digital designs
- FLGA2577: 2577-ball flip-chip FCBGA package. Sufficient ball pins support large-scale parallel I/O layout, full deployment of built-in transceivers and multi-channel high-speed memory interface docking
- I: Industrial temperature rating, junction temperature operating range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total Logic Cells: 1,938,720
- Configurable CLB Slices: 110,640
- Total Flip-Flops: 2,212,800
- Total LUT Lookup Tables: 1,106,400
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic units: 1728 units, applicable to fixed-point and floating-point computation, large-scale FFT operation, radar signal modulation and demodulation, cryptographic algorithm acceleration and medium-to-large matrix calculation tasks
- Total Block RAM capacity: 53.2 Mb, used for large-capacity image frame buffering, deep FIFO data cache, waveform storage and algorithm parameter lookup tables
- Distributed RAM capacity: 14.6 Mb, deployed for on-chip small buffer storage and lightweight asynchronous data interaction
3. Clock Management Subsystem
- 16 MMCM clock management tiles
- 16 PLL phase locked loops
Multiple independent clock domains can be configured flexibly, supporting clock phase fine-tuning, signal delay compensation and high-frequency jitter suppression, which satisfies strict synchronous timing requirements of complex large-scale digital systems
4. High-Speed Serial Transceivers
- 32 channels of GTH differential high-speed transceivers
Maximum transmission rate per lane reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Integrated hard Ethernet IP blocks simplify high-bandwidth network interface development work
5. I/O Interfaces and On-Chip Monitoring Module
- Configurable user I/O pins: 1248
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards
The embedded system monitoring module continuously monitors chip junction temperature, internal power supply voltages and external analog input signals in real time
Power Supply Characteristics
Nominal core operating voltage ranges between 0.85V and 0.9V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt mutually isolated power domains, supporting partial module power shutdown to reduce overall power consumption flexibly
Typical overall power consumption ranges from 24W to 62W. For continuous stable full-load operation under the upper limit of industrial temperature, forced air cooling system is mandatory
Packaging and SMT Assembly Specifications
- Package form: 2577-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported inside anti-static trays to avoid electrostatic damage during large-scale PCB production
Environmental Adaptability and Operational Reliability
The chip maintains long-term stable operation under severe temperature fluctuation, mechanical shock, vibration and strong electromagnetic interference environments. It supports AES bitstream encryption, dynamic partial reconfiguration, SEU single-event upset detection and correction, with optimized radiation resistance, perfectly suited for aerospace, military equipment and field rugged deployment scenarios
Escenarios típicos de aplicación
- Medium-scale ASIC and SoC hardware prototype verification, digital logic emulation platforms
- Core processing boards for carrier-grade optical communication and 100G network switching devices
- Airborne radar signal preprocessing units, aerospace onboard payload data computing modules
- Ultra-wideband signal analyzers, high-precision spectrum testing instruments
- Military rugged VPX embedded computing mainboards
- High-speed data gateway equipment and industrial cryptographic acceleration hardware
