XCVU190-1FLGA2577E

Manufacturer: Xilinx
Logic Cells: 2,100,000
Logic Slices: 328,000
Embedded RAM (eRAM): 75,960 Kb (2,110 × 36Kb Block RAM)
Maximum User I/O: 900
Package: FLGA2577 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU190-1FLGA2577E Virtex® UltraScale 134,28 -1,00 2,349,900 LE 150,937,600 bits 448 0.922–0.979 V SMD / FBGA 0°C ~ +100°C (E) FBGA-2577 2577-FCBGA