| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU190-1FLGA2577E | Virtex® UltraScale | 134,28 | -1,00 | 2 349 900 LE | 150 937 600 bits | 448 | 0,922–0,979 V | SMD / FBGA | 0 °C ~ +100 °C (E) | FBGA-2577 | 2577-FCBGA |
XCVU190-1FLGA2577E
Fabricante: Xilinx
Células lógicas: 2,100,000
Rebanadas lógicas: 328,000
RAM integrada (eRAM): 75 960 Kb (2110 bloques de RAM de 36 Kb)
E/S máxima por usuario: 900
Paquete: FLGA2577 (BGA de chip invertido)
Grado de velocidad: -1
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Definición del número de pieza
This extended temperature grade high-performance FPGA belongs to Xilinx Virtex UltraScale series, manufactured on 20nm FinFET process. It owns identical logic, computing, memory and high-speed interface resources as the industrial grade counterpart, only differing in continuous operating temperature range, targeted at indoor communication equipment, laboratory testing instruments, chip verification platforms and stationary industrial devices without low-temperature working requirements.
- XCVU190: Mid-to-high capacity flagship device of Virtex UltraScale family, equipped with complete high-speed serial interconnection architecture and balanced overall resource allocation
- -1: Speed Grade 1, low-power optimized timing grade. It prioritizes power consumption reduction and thermal stability instead of maximum operating frequency, suitable for long-running equipment with limited heat dissipation conditions
- FLGA2577: 2577-ball flip-chip FCBGA large-size package. Sufficient ball pins support full layout of all on-chip transceivers, large-scale parallel signal wiring and docking of multi-channel high-speed memory modules
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total Logic Cells: 1938720
- Configurable CLB Slices: 110640
- Total Flip-Flops: 2212800
- Total LUT Lookup Tables: 1106400
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic computing blocks: 1728 units, applicable to fixed-point and floating-point operation, large-scale FFT spectrum calculation, communication baseband modulation and demodulation, cryptographic algorithm acceleration and medium-scale matrix computing tasks
- Total Block RAM capacity: 53.2 Mb, used for large-capacity image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter lookup tables
- Distributed RAM capacity: 14.6 Mb, deployed for on-chip small temporary cache and lightweight asynchronous data buffering
3. Clock Management Subsystem
- 16 MMCM clock management tiles
- 16 PLL phase-locked loops
Multiple independent clock domains can be configured flexibly, supporting clock phase fine adjustment, signal transmission delay compensation and high-frequency clock jitter suppression, which meets strict synchronous timing requirements of complex large-scale digital systems
4. High-Speed Serial Transceivers
- 32 channels of GTH differential high-speed transceivers
The maximum transmission rate per lane reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard Ethernet IP cores simplify the development of high-bandwidth network interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 1248
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all commonly used single-ended and differential signal standards
The embedded system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals
Power Supply Characteristics
Nominal core operating voltage ranges from 0.85V to 0.9V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt mutually isolated independent power domains, supporting partial module power shutdown to flexibly reduce overall power consumption
Typical total power consumption ranges from 20W to 56W. For stable continuous full-load operation under the upper temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package form: 2577-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after the vacuum package is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported inside anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
The chip is designed for indoor constant-temperature working environments, capable of stable long-term operation under moderate temperature fluctuation, slight vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, without special anti-radiation reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged working conditions
Escenarios típicos de aplicación
- Medium-scale ASIC and SoC hardware prototype verification platforms, digital logic emulation equipment placed in laboratories
- Core processing boards for indoor backbone optical communication switches and data center network equipment
- Desktop high-precision spectrum analyzers, signal generators and multi-channel high-speed data acquisition instruments
- Indoor industrial intelligent control mainboards and production line real-time image processing equipment
- Algorithm development and debugging platforms for universities and research institutions
- High-speed data interconnection gateway equipment for fixed-site server rooms
