XCVU095-3FFVC1517E

Manufacturer: Xilinx
Logic Cells: 1,143,360
Logic Slices: 178,650
Embedded RAM (eRAM): 48,960 Kb (1,360 × 36Kb Block RAM)
Maximum User I/O: 520
Package: FFVC1517 (Flip-Chip BGA)
Speed Grade: -3
Operating Temperature: Extended (0°C to +100°C)

SEND US A MESSAGE

    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU095-3FFVC1517E Virtex® UltraScale 67,20 -3,00 1,176,000 LE 60800000 832 0.922 V ~ 0.979 V Surface mount 0 °C ~ +100 °C (E) 1517-FBGA / FCBGA 1517-FCBGA (Flip-Chip BGA)