| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU095-3FFVC1517E | Virtex® UltraScale | 67,20 | -3,00 | 1 176 000 LE | 60800000 | 832 | 0,922 V ~ 0,979 V | Montaje en superficie | 0 °C ~ +100 °C (E) | 1517-FBGA / FCBGA | 1517-FCBGA (BGA con chip invertido) |
XCVU095-3FFVC1517E
Fabricante: Xilinx
Células lógicas: 1,143,360
Rebanadas lógicas: 178,650
RAM integrada (eRAM): 48 960 Kb (1360 bloques de RAM de 36 Kb)
E/S máxima por usuario: 520
Paquete: FFVC1517 (Flip-Chip BGA)
Grado de velocidad: -3
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Definición del número de pieza
This extended commercial temperature high-speed FPGA belongs to Xilinx Virtex UltraScale series, manufactured based on 20nm FinFET process. It features moderate logic resources, abundant arithmetic units and high-speed serial interfaces, oriented to indoor high-speed communication boards, laboratory test instruments, small-scale chip verification platforms and stationary industrial intelligent control equipment working under stable ambient temperature conditions.
- XCVU095: Entry-to-mid capacity model of Virtex UltraScale lineup, equipped with complete high-speed interconnection framework and compact resource allocation
- -3: Speed Grade 3, the highest timing grade for this series. It delivers maximum achievable operating clock frequency and excellent timing closure performance for high-frequency, high-throughput digital designs with rigorous timing constraints
- FFVC1517: 1517-ball compact flip-chip FCBGA package. The small form factor supports equipment miniaturization, while reserved pins fully accommodate layout of on-chip transceivers, general-purpose I/O and peripheral memory circuits
- E: Extended commercial temperature grade, steady junction temperature working range: 0°C ~ +100°C
On-Chip Hardware Resource Details
1. Programmable Logic Resources
- Total Logic Cells: 1182000
- Configurable CLB Slices: 67560
- Total Flip-Flops: 1351200
- Total LUT Lookup Tables: 675600
- Distributed RAM Capacity: 9.2 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic blocks: 900 units, suitable for fixed-point and floating-point computation, FFT spectrum analysis, communication baseband processing, cryptographic algorithm acceleration and medium-scale matrix calculation
- Total Block RAM Capacity: 35.6 Mb, used for image frame buffering, deep FIFO data cache, waveform storage and algorithm parameter lookup tables
No UltraRAM memory is integrated inside this chip
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Multiple independent clock domains can be freely configured to adjust clock phase precisely, compensate signal transmission delay and suppress clock jitter, meeting strict synchronous timing demands of complex digital systems
4. High-Speed Serial Transceivers
- 24 GTH differential high-speed transceivers
Each lane supports peak transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial protocols. Embedded hard Ethernet IP simplifies high-bandwidth network interface development
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 624
Multiple I/O voltage domains ranging from 1.2V to 3.3V are available, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream single-ended and differential signal standards
Built-in system monitor tracks chip junction temperature, internal power supply voltages and external analog input signals in real time continuously
Power Supply Specifications
Core operating voltage for Speed Grade 3 is between 0.87V and 0.93V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt separate power domains, allowing partial module power gating to adjust overall power consumption flexibly
Typical total power consumption ranges from 12W to 40W. For sustained full-load operation at maximum temperature limit, forced air cooling is required
Packaging and SMT Assembly Requirements
- Package form: 1517-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. Reflow soldering must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Devices are stored and transported in anti-static trays to prevent electrostatic damage during PCB mass production
Environmental Adaptability and Reliability
This chip is designed for indoor constant-temperature environments. It runs reliably under mild temperature variations, slight mechanical vibration and regular electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU error detection and correction, without radiation-hardened reinforcement, so it cannot work normally under outdoor low temperature and harsh rugged conditions
Escenarios típicos de aplicación
- Small-scale digital chip prototype verification and algorithm debugging platforms in laboratories
- Low-port density 100G optical communication line cards and server internal high-speed interconnection boards
- Desktop portable spectrum analyzers, arbitrary waveform generators and multi-channel data acquisition equipment
- Indoor small industrial machine vision inspection and real-time image processing control units
- Teaching and research development boards for university electronic engineering majors
- Small industrial data gateways and lightweight encryption acceleration hardware
