| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU5P-3FFVB676E | Kintex UltraScale+ | 0,00 | -3,00 | — | — | 0 | — | — | — | — | — |
XCKU5P-3FFVB676E
Manufacturer: AMD / Xilinx
Logic Cells: 2,540,000
Logic Slices: 158,000
Embedded RAM (eRAM): 190,000 Kb
Package: FFVB676 (Flip-Chip BGA)
Operating Temperature: Extended (0°C to +85°C TJ)
