XCKU3P-1SFVB784I

Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 20,900+
Embedded RAM (eRAM): 75,000+ Kb
Package: SFVB784 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU3P-1SFVB784I Kintex® UltraScale+ 20,34 -1,00 355,950 LE 31641600 304 0.825 V ~ 0.876 V Surface Mount −40 °C ~ +100 °C (I grade) 784-FCBGA 784-FCBGA (≈23×23 mm).