XCKU035-2FBVA676C

Manufacturer: Xilinx
Logic Cells: 410,000
Logic Slices: 64,100
Embedded RAM (eRAM): 21,600 Kb (600 × 36Kb Block RAM)
Maximum User I/O: 300
Package: FBVA676 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Commercial (0°C to +85°C)

SEND US A MESSAGE

    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU035-2FBVA676C Kintex® UltraScale 25,39 -2,00 444,343 LE 19,456,000 bits 312 0.922 V – 0.979 V Surface Mount 0 °C – 85 °C FCBGA-676 676-FCBGA (27×27)