| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU035-2FBVA676C | Kintex® UltraScale | 25,39 | -2,00 | 444,343 LE | 19 456 000 бит | 312 | 0,922 V - 0,979 V | Монтаж на поверхность | 0 °C - 85 °C | FCBGA-676 | 676-FCBGA (27×27) |
XCKU035-2FBVA676C
Производитель: Xilinx
Логические ячейки: 410,000
Логические срезы: 64,100
Встроенная оперативная память (eRAM): 21,600 Kb (600 × 36Kb Block RAM)
Максимальный пользовательский ввод/вывод: 300
Упаковка: FBVA676 (Flip-Chip BGA)
Класс скорости: -2
Рабочая температура: Коммерческий (от 0°C до +85°C)
Технические характеристики
Part Number Detailed Decoding
This is AMD Xilinx Kintex UltraScale series high-performance FPGA built on 20nm UltraScale FinFET process, focused on medium-scale high-speed signal processing, network acceleration and high-bandwidth data transmission systems.
- XCKU035: Mid-capacity mainstream device of Kintex UltraScale family
- -2: Speed Grade 2, balanced performance grade, optimal compromise between maximum operating frequency and power consumption
- FBVA676: 676-ball flip-chip FCBGA package, physical dimension 27mm × 27mm, ball pitch 1.0mm
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°CDigiKey
On-Chip Core Hardware Resources
Logic & DSP Computing Resources
- Total System Logic Cells: 444,343
- Total Flip-Flops: 406,256
- DSP48E2 dedicated arithmetic slices: 1,920 units
Applied for large-scale FFT, digital filtering, wireless baseband processing, multi-channel image algorithm acceleration and matrix arithmetic operations
Embedded Memory Resources
- Total Block RAM capacity: 19.46 Mbit, composed of independent 36K dual-port RAM modules for massive data buffering, FIFO queues and algorithm intermediate storage
- LUT-based distributed RAM for ultra-low latency small-capacity temporary cache
Clock Management Subsystem
Multiple MMCM + PLL clock management tiles integrated on chip, supporting clock multiplication/division, arbitrary phase offset adjustment and jitter suppression, perfectly adapting to timing requirements of multi-clock high-speed synchronous digital systems
High-Speed Serial Transceivers & General I/O
- 16-channel GTH high-speed differential transceivers, maximum single-lane rate up to 16.375 Gbps
Supported protocols: PCIe Gen3, 10G/25G Ethernet, JESD204B/C, Aurora, CPRI fiber transmission
- Total available configurable user I/O pins: 312
Equipped with HR wide-voltage I/O banks and HP high-performance I/O banks; compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Built-in SYSMON system monitoring module: real-time detection of chip internal junction temperature, multi-group power supply voltages and external analog input signals
Технические характеристики источника питания
- Nominal core logic supply voltage: 0.922V ~ 0.979V
Independent isolated power domains are allocated for core logic, block RAM, transceivers and I/O interfaces. Dynamic voltage and frequency scaling can be enabled to reduce power consumption under light workloads
Typical full-load overall power consumption: 45W ~ 95W, forced air cooling is required for continuous stable operation
Packaging & SMT Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering procedures must be completed within 72 hours after vacuum packaging is unsealed
- Fully lead-free construction, compliant with RoHS3 and REACH environmental directives
- Packaged in anti-static trays for automated industrial PCB mass production
Environmental & Reliability Features
Only applicable to indoor constant-temperature commercial environments such as computer rooms and laboratories, unable to adapt to outdoor extreme low/high-temperature industrial scenarios.
It supports 256-bit AES bitstream encryption for design IP protection, SEU single-event upset radiation error correction and partial dynamic reconfiguration, delivering stable performance for communication equipment, laboratory precision instruments and commercial high-speed acceleration hardware.
Типичные сценарии применения
- Indoor small cell base station baseband processing boards, wireless communication remote radio unit signal processing modules
- Data center smart NIC, 100G Ethernet switching gateway and storage array controller acceleration cards
- High-end bench oscilloscopes, spectrum analyzers and multi-channel ultra-high-speed data acquisition instruments
- Multi-channel industrial machine vision platforms, medical imaging reconstruction and video post-processing equipment
- Radar echo signal preprocessing, aerospace onboard high-speed data forwarding units
- FPGA algorithm verification prototype boards and custom high-speed embedded accelerator core modules
