XC7Z100-1FFG900C

Manufacturer: Xilinx
Logic Cells: 444,000
Logic Slices: 69,000
Embedded RAM (eRAM): 26,280 Kb (730 × 36Kb Block RAM)
Maximum User I/O: 300
Package: FFG900 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z100-1FFG900C Zynq-7000 26.150,00 -1,00 277,400 26200000 250 1.0 V Surface Mount Commercial (0 °C ~ 85 °C) BGA-900 900-FCBGA (31×31 mm)