| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-1FFG900C | Zynq-7000 | 26.150,00 | -1,00 | 277,400 | 26200000 | 250 | 1.0 V | 표면 실장 | 상업용(0°C ~ 85°C) | BGA-900 | 900-FCBGA(31×31mm) |
사양
부품 번호 정의
This is the highest-speed commercial-grade flagship heterogeneous all-programmable SoC of AMD Xilinx Zynq-7000 family, manufactured on mature 28nm semiconductor process. It combines dual-core ARM Cortex-A9 processing subsystem and maximum-capacity Kintex-7 FPGA programmable logic, specially optimized for ultra-high-frequency complex digital logic, high-throughput signal processing and high-speed data transmission applications running in stable indoor constant-temperature environments.
- XC7Z100: Top flagship model of Zynq-7000 series, equipped with the largest full-set Kintex-7 FPGA resources across the entire product lineup
- -1: Speed Grade 1, premium highest-speed timing tier. It features the shortest signal propagation delay, maximum achievable operating frequency and optimal timing closure performance, exclusively used for demanding ultra-high-speed logic designs that cannot be satisfied by -2 speed grade
- FFG900: 900-ball flip-chip FCBGA compact package, physical dimension 31mm × 31mm, ball pitch 1.0mm. Compact footprint facilitates miniaturized system layout compared to the 1156-ball variant
- C: Commercial temperature specification, operating junction temperature range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor with CoreSight debug architecture, maximum stable operating frequency up to 1000MHz
- Each core integrates independent 32KB instruction L1 cache and 32KB data L1 cache; shared 1MB L2 cache
- Embedded NEON SIMD floating-point arithmetic unit and hardware FPU, delivering powerful acceleration for massive digital signal algorithms, large-volume multimedia encoding and decoding tasks
- 256KB on-chip OCM high-speed memory integrated inside the chip; supports external DDR2 / DDR3 high-speed memory expansion
- Comprehensive standard peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC card interface, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, multi-channel DMA controller
- Supports 256-bit AES encrypted secure boot and SHA-256 firmware integrity verification to prevent unauthorized firmware tampering and guarantee embedded system security
2. Programmable Logic (PL: Kintex-7 Top-Tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, ideal for massive FFT computation, digital filtering, wireless baseband signal processing, multi-channel 4K image algorithm acceleration and large-scale matrix calculation workloads
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management tiles for multi-domain clock generation and effective suppression of high-frequency clock jitter
- 16-channel GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora mainstream high-speed serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 362
- I/O 뱅크 전압을 1.2V에서 3.3V 사이로 조정할 수 있으며, LVCMOS, LVDS, HSTL, SSTL 및 모든 주요 차동 신호 표준과 완벽하게 호환됩니다.
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die internal junction temperature, all internal power supply voltages and external analog input signals
전원 공급 장치 사양
Nominal core internal supply voltage (VCCINT): 1.0V
Independent isolated power domains are allocated separately for PS processor subsystem and PL FPGA logic area
Typical overall power consumption: 19W ~ 45W; active forced-air cooling heatsink is mandatory for long-term stable full-load operation under peak frequency working conditions
포장 및 SMT 조립 요건
- Package form: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
환경 적응성 및 신뢰성
The chip is only designed for stable constant-temperature indoor scenarios including laboratories, equipment rooms and data center terminals. It is not applicable to outdoor industrial environments with drastic temperature swings and intense electromagnetic interference.
It supports AES bitstream encryption protection and SEU single-event upset error detection, providing ultra-high timing performance and long-term operational stability for high-end test instruments, software-defined radio platforms and high-performance embedded computing devices.
일반적인 애플리케이션 시나리오
- Ultra-high-speed software-defined radio baseband processing platforms, laboratory-grade wireless communication comprehensive test instruments
- Multi-channel 4K/8K video real-time encoding, decoding and intelligent analysis servers
- High-end digital oscilloscopes, spectrum analyzers and ultra-high-speed multi-channel data acquisition recorders
- Low-latency network gateway and storage acceleration control modules for data center edge nodes
- High-precision medical image reconstruction and diagnostic host control equipment
- High-performance embedded SOM core modules and ultra-complex algorithm prototype verification platforms
