XC7Z045-2FFG900I

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z045-2FFG900I Zynq-7000 SoC 27.325,00 -2,00 350,000 20,090,880 340 ~1.0 V Surface mount (FCBGA/FFG) −40 °C ~ +100 °C FCBGA-900 900-FCBGA (31×31 mm)