XC7Z035-2FFG900E

Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 34,400
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +125°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z035-2FFG900E Zynq-7000 0,00 -2,00 0