XC7K70T-1FBG676C

Manufacturer: Xilinx
Logic Cells: 74,880
Logic Slices: 11,700
Embedded RAM (eRAM): 4,860 Kb (135 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K70T-1FBG676C Kintex-7 5.125,00 -1,00 65,600 4976640 300 0.97 ~ 1.03 Surface Mount 0 °C ~ 85 °C (C) 676-FCBGA 676-FCBGA (27×27)