XC7K325T-2FFG676C

Manufacturer: Xilinx
Logic Cells: 326,080
Logic Slices: 51,200
Embedded RAM (eRAM): 12,288 Kb
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K325T-2FFG676C Kintex-7 25.475,00 -2,00 326,080 16404480 400 0.97 – 1.03 V (typ 1.0 V) Surface mount 0 °C — 85 °C 676-FBGA/FCBGA 676-FCBGA (27×27)