XC7A200T-2FBG676I

Manufacturer: Xilinx
Logic Cells: 215,360
Logic Slices: 33,650
Embedded RAM (eRAM): 13,140 Kb (365 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7A200T-2FBG676I Artix-7 -2,00 16.825,00 215,360 13455360 400 0.95 – 1.05 V Surface mount −40°C – +100°C (I) FCBGA-676 676-FCBGA