XC5VLX330-1FFG1760C

Manufacturer: Xilinx
Logic Cells: 326,080
Logic Slices: 52,000
Embedded RAM (eRAM): 13,440 Kb
Package: FFG1760 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX330-1FFG1760CVirtex-5 LX33025.920,00-1,00331776106168321.2000.95 V – 1.05 VSurface Mount0 °C ~ 85 °C (TJ)1760-BBGA, FCBGA1760-FCBGA (42.5 × 42.5 mm)

    The XC5VLX330-1FFG1760C is a high-density FPGA from Xilinx Virtex-5 series, designed for complex logic processing and high-speed embedded applications.

    ✔ Original & Compatible Available
    ✔ Fast Shipping Worldwide
    ✔ RFQ Response Within 12 Hours


    🔥 Stock Status

    • 32 pcs available
    • Incoming: 120 pcs (2–3 weeks)
      ⚡ High demand – limited stock

    Specifications

    • Manufacturer: Xilinx
    • Series: Virtex-5
    • Logic Cells: 331,776
    • Package: FFG1760
    • Speed Grade: -1
    • Temp Range: Commercial
    • Core Voltage: 1.0V

    Technical Description

    The XC5VLX330 FPGA provides high logic density and advanced DSP capabilities, enabling efficient signal processing and scalable system design. It is widely used in telecom infrastructure, industrial automation, and embedded computing.


    🔄 Cross Reference

    • XC5VLX330-2FFG1760C
    • XC5VLX330T-1FFG1738C
    • XC5VLX220-1FFG1153C
    • Kintex-7 XC7K325T

    Applications

    • Data Communication
    • Industrial Control
    • Medical Imaging
    • Aerospace Systems

    📩 RFQ

    Get best price & availability today →harriet@lxbchip.com