XC5VFX200T-2FFG1738I

Manufacturer: Xilinx
Logic Cells: 207,360
Logic Slices: 32,640
Embedded RAM (eRAM): 7,380 Kb (410 × 18Kb Block RAM)
Maximum User I/O: 720
Package: FFG1738 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC5VFX200T-2FFG1738I Virtex-5 FXT 15.360,00 -2,00 196608 16809984 960 0.95 V–1.05 V Surface Mount -40 °C ~ +100 °C 1738-FBGA / FCBGA 1738-FCBGA (≈42.5×42.5 mm)

    The XC5VFX200T-2FFG1738I is one of the larger devices in the Virtex-5 FXT family from Xilinx (now part of AMD). It’s built on a 65nm process and combines high-density programmable logic with embedded PowerPC 440 processors and RocketIO GTX multi-gigabit transceivers.

    From a practical engineering point of view, this device is used when the design simply cannot compromise on logic scale or serial bandwidth. It offers substantial LUT resources, strong DSP capability with DSP48E slices, and large Block RAM capacity — suitable for data-intensive systems such as telecom baseband units, defense electronics, high-speed data acquisition, and complex industrial platforms.

    The -2 speed grade provides better timing performance compared to -1 devices, which gives more margin in high-frequency or timing-sensitive designs. The FFG1738 package (1738-ball flip-chip BGA) supports very high I/O count and dense routing, typically seen on multi-layer backplane or high-speed networking boards.

    The industrial temperature range (-40°C to +100°C) makes it appropriate for harsher environments where reliability is critical.

    In short, the XC5VFX200T-2FFG1738I isn’t chosen for cutting-edge node size — it’s chosen because it’s proven, powerful, and stable. For long-lifecycle systems or performance-heavy legacy platforms, it remains a solid and dependable FPGA solution.