XC5VFX130T-2FFG1738I

Manufacturer: Xilinx Logic Cells: 130,560 Logic Slices: 20,480 Embedded RAM (eRAM): 6,048 Kb (336 × 18Kb Block RAM) Package: FFG1738 (Flip-Chip BGA) Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VFX130T-2FFG1738IVirtex-5 FXT10.240,00-2,00131072109854728400.95 V–1.05 VSurface Mount-40 °C ~ +100 °C1738-FBGA, FCBGA1738-FCPBGA (42.5×42.5 mm)

    XC5VFX130T-2FFG1738I – Xilinx Virtex-5 FXT FPGA

    The XC5VFX130T-2FFG1738I is a high-end device in the Xilinx Virtex-5 FXT FPGA family, designed for systems that require large logic capacity, embedded processing, and high-speed serial communication in a single platform. At LXB Semicon, this part is commonly supplied for industrial and telecommunications projects where performance margins, platform stability, and long-term support are key design considerations.

    Logic Capacity and Embedded Processing

    With approximately 130K logic cells, the XC5VFX130T offers substantial resources for complex datapaths, multi-channel data processing, and hardware acceleration. A core advantage of the FXT family is the integration of dual PowerPC® 440 processors, enabling hardware-software co-design directly within the FPGA.

    This architecture allows designers to handle real-time control, protocol processing, and system management internally, reducing latency and minimizing the need for external processors.

    The -2 speed grade provides improved timing performance and higher achievable clock frequencies compared to lower speed grades, making this device suitable for designs with tighter timing requirements and high data throughput.

    High-Speed Serial Transceivers

    The XC5VFX130T integrates RocketIO™ GTX transceivers, supporting high-speed serial interfaces such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and custom point-to-point links. This level of integration helps simplify board design and improves overall signal integrity in high-bandwidth systems.

    On-Chip Memory and System Integration

    A significant amount of Block RAM is available for buffering, packet queues, and local memory storage for embedded processors. This reduces dependence on external memory, improves determinism, and supports consistent low-latency operation in real-time systems.

    The Virtex-5 FXT platform benefits from a mature and well-documented Xilinx toolchain, along with a wide range of proven IP cores, which is especially valuable for long-life and maintenance-driven projects.

    Package and Industrial Temperature Rating

    The FFG1738 flip-chip BGA package provides a very high pin count, allowing flexible I/O allocation and support for interface-dense designs.
    The industrial temperature grade (I) ensures reliable operation across extended temperature ranges, making this FPGA suitable for industrial automation, outdoor communication equipment, and other harsh-environment applications.