XC4VLX160-11FF1148I

Manufacturer: Xilinx
Logic Cells: 152,064
Logic Slices: 67,584
Embedded RAM (eRAM): 5,184 Kb (288 × 18Kb Block RAM)
Package: FFG1148 (Flip?Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

SEND US A MESSAGE

    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC4VLX160-11FF1148IVirtex-4 LX16.896,00-11,00152064LE5308416 bits7681.14 V ~ 1.26 VSurface MountIndustrial (-40°C ~ +100°C)1148-BBGA, FCBGA1148-FCPBGA (35×35)

    XC4VLX160-11FF1148I: Industrial-Grade High-Performance Logic Leader

    The XC4VLX160-11FF1148I represents the pinnacle of the Virtex®-4 LX family, combining massive logic density with the high-performance -11 speed grade and Industrial temperature resilience. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this FPGA is specifically designed for engineers who need to solve complex logic challenges without sacrificing timing margins or thermal stability in harsh environments.

    Core Engineering Advantages

    • Superior Timing Margins (-11 Speed Grade): The -11 speed grade offers significantly faster logic switching and reduced propagation delays compared to the standard -10 series. This is critical for high-frequency designs where timing closure is tight.

    • Industrial-Grade Reliability: Rated for an operating junction temperature range of -40°C to +100°C. This ensures reliable operation in demanding industrial automation, outdoor telecommunications, and aerospace ground systems.

    • High Logic-to-Pin Ratio: With 152,064 Logic Cells and 768 User I/Os, the LX160 provides the “horsepower” and connectivity required for high-width parallel data processing and multi-interface bridging.

    • Optimized Memory & DSP Blocks: Features 5,184 Kb of Block RAM and 96 DSP48 slices. The DSP48 slices are hard-coded for high-speed arithmetic, making this device highly capable for real-time signal processing (DSP) and filtering.

    • Flip-Chip Packaging (FF1148): The Flip-Chip BGA package minimizes parasitic inductance and provides excellent thermal conductivity, allowing the chip to maintain performance even under high toggle rates.


    Technical Specification Summary

    MetricSpecification
    Logic Cells152,064
    CLB Array17,136
    Total Block RAM5,184 Kb
    DSP48 Slices96
    Available User I/O768
    Speed Grade-11 (Fast)
    Temperature GradeIndustrial (-40°C to +100°C)
    Package TypeFF1148 (Flip-Chip BGA)

    Why Specify the LX160-11I?

    1. Mature and Stable Performance

    In a market often pushed toward 7-series or UltraScale, the Virtex-4 LX160 remains a “gold standard” for reliability. Its 90nm process is exceptionally stable, offering a predictable EMI profile and robust resistance to single-event upsets compared to smaller, more volatile nodes.

    2. Seamless Timing Closure

    The jump to the -11 speed grade is a strategic choice for designs involving high-speed memory interfaces (DDR2) or complex LVDS signaling. It provides the extra nanoseconds of slack often required to stabilize a high-utilization design.

    3. Long-Lifecycle Support

    Choosing this part is ideal for high-value equipment that requires a 10-15 year service life. It is a drop-in high-performance solution for existing Virtex-4 sockets that need better timing performance than the standard grade.


    Applications

    • High-End Industrial Control: Multi-axis robotics and motion control.

    • Signal Intelligence: Real-time data encryption and high-bandwidth filtering.

    • Medical Imaging: Complex image reconstruction and ultrasound signal processing.

    • Test & Measurement: High-speed logic analyzers and automated test equipment (ATE).