XC4VLX160-11FF1148I

Üretici firma: Xilinx
Mantık Hücreleri: 152,064
Mantık Dilimleri: 67,584
Gömülü RAM (eRAM): 5.184 Kb (288 × 18Kb Blok RAM)
Paket: FFG1148 (Flip?Chip BGA)
Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX160-11FF1148I Virtex-4 LX 16.896,00 -11,00 152064LE 5308416 bit 768 1,14 V ~ 1,26 V Yüzey Montajı Endüstriyel (-40°C ~ +100°C) 1148-BBGA, FCBGA 1148-FCPBGA (35×35)

    XC4VLX160-11FF1148I: Industrial-Grade High-Performance Logic Leader

    Bu XC4VLX160-11FF1148I represents the pinnacle of the Virtex®-4 LX family, combining massive logic density with the high-performance -11 hız derecesi ve Endüstriyel sıcaklık resilience. Built on the 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this FPGA is specifically designed for engineers who need to solve complex logic challenges without sacrificing timing margins or thermal stability in harsh environments.

    Temel Mühendislik Avantajları

    • Superior Timing Margins (-11 Speed Grade): The -11 speed grade offers significantly faster logic switching and reduced propagation delays compared to the standard -10 series. This is critical for high-frequency designs where timing closure is tight.

    • Endüstriyel Sınıf Güvenilirlik: Rated for an operating junction temperature range of -40°C ila +100°C. This ensures reliable operation in demanding industrial automation, outdoor telecommunications, and aerospace ground systems.

    • High Logic-to-Pin Ratio: ile 152,064 Logic Cells ve 768 Kullanıcı I/O'ları, the LX160 provides the “horsepower” and connectivity required for high-width parallel data processing and multi-interface bridging.

    • Optimized Memory & DSP Blocks: Özellikler 5,184 Kb of Block RAM ve 96 DSP48 dilimi. The DSP48 slices are hard-coded for high-speed arithmetic, making this device highly capable for real-time signal processing (DSP) and filtering.

    • Flip-Chip Packaging (FF1148): The Flip-Chip BGA package minimizes parasitic inductance and provides excellent thermal conductivity, allowing the chip to maintain performance even under high toggle rates.


    Technical Specification Summary

    Metrik Şartname
    Mantık Hücreleri 152,064
    CLB Dizisi 17,136
    Toplam Blok RAM 5,184 Kb
    DSP48 Dilimleri 96
    Available User I/O 768
    Hız Sınıfı -11 (Fast)
    Sıcaklık Sınıfı Endüstriyel (-40°C ila +100°C)
    Paket Tipi FF1148 (Flip-Chip BGA)

    Why Specify the LX160-11I?

    1. Mature and Stable Performance

    In a market often pushed toward 7-series or UltraScale, the Virtex-4 LX160 remains a “gold standard” for reliability. Its 90nm process is exceptionally stable, offering a predictable EMI profile and robust resistance to single-event upsets compared to smaller, more volatile nodes.

    2. Seamless Timing Closure

    The jump to the -11 speed grade is a strategic choice for designs involving high-speed memory interfaces (DDR2) or complex LVDS signaling. It provides the extra nanoseconds of slack often required to stabilize a high-utilization design.

    3. Long-Lifecycle Support

    Choosing this part is ideal for high-value equipment that requires a 10-15 year service life. It is a drop-in high-performance solution for existing Virtex-4 sockets that need better timing performance than the standard grade.


    Uygulamalar

    • High-End Industrial Control: Multi-axis robotics and motion control.

    • Signal Intelligence: Real-time data encryption and high-bandwidth filtering.

    • Tıbbi Görüntüleme: Complex image reconstruction and ultrasound signal processing.

    • Test ve Ölçüm: High-speed logic analyzers and automated test equipment (ATE).