XC4VLX160-11FF1148I

Производитель: Xilinx
Логические ячейки: 152,064
Логические срезы: 67,584
Встроенная оперативная память (eRAM): 5 184 Кб (288 × 18 Кб блочной оперативной памяти)
Упаковка: FFG1148 (Flip?Chip BGA)
Рабочая температура: Промышленные (от -40°C до +100°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC4VLX160-11FF1148I Virtex-4 LX 16.896,00 -11,00 152064LE 5308416 бит 768 1,14 V ~ 1,26 V Монтаж на поверхность Промышленные (-40°C ~ +100°C) 1148-BBGA, FCBGA 1148-FCPBGA (35×35)

    XC4VLX160-11FF1148I: Industrial-Grade High-Performance Logic Leader

    Сайт XC4VLX160-11FF1148I represents the pinnacle of the Virtex®-4 LX family, combining massive logic density with the high-performance -11 класс скорости и Промышленная температура resilience. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this FPGA is specifically designed for engineers who need to solve complex logic challenges without sacrificing timing margins or thermal stability in harsh environments.

    Основные инженерные преимущества

    • Superior Timing Margins (-11 Speed Grade): The -11 speed grade offers significantly faster logic switching and reduced propagation delays compared to the standard -10 series. This is critical for high-frequency designs where timing closure is tight.

    • Надежность промышленного класса: Rated for an operating junction temperature range of от -40°C до +100°C. This ensures reliable operation in demanding industrial automation, outdoor telecommunications, and aerospace ground systems.

    • High Logic-to-Pin Ratio: С 152,064 Logic Cells и 768 User I/Os, the LX160 provides the “horsepower” and connectivity required for high-width parallel data processing and multi-interface bridging.

    • Optimized Memory & DSP Blocks: Характеристики 5,184 Kb of Block RAM и 96 DSP48 slices. The DSP48 slices are hard-coded for high-speed arithmetic, making this device highly capable for real-time signal processing (DSP) and filtering.

    • Flip-Chip Packaging (FF1148): The Flip-Chip BGA package minimizes parasitic inductance and provides excellent thermal conductivity, allowing the chip to maintain performance even under high toggle rates.


    Technical Specification Summary

    Метрика Технические характеристики
    Логические ячейки 152,064
    CLB Array 17,136
    Всего блоков оперативной памяти 5,184 Kb
    Ломтики DSP48 96
    Доступные пользовательские входы/выходы 768
    Степень скорости -11 (Fast)
    Температурный класс Промышленные (от -40°C до +100°C)
    Тип упаковки FF1148 (Flip-Chip BGA)

    Why Specify the LX160-11I?

    1. Mature and Stable Performance

    In a market often pushed toward 7-series or UltraScale, the Virtex-4 LX160 remains a “gold standard” for reliability. Its 90nm process is exceptionally stable, offering a predictable EMI profile and robust resistance to single-event upsets compared to smaller, more volatile nodes.

    2. Seamless Timing Closure

    The jump to the -11 speed grade is a strategic choice for designs involving high-speed memory interfaces (DDR2) or complex LVDS signaling. It provides the extra nanoseconds of slack often required to stabilize a high-utilization design.

    3. Long-Lifecycle Support

    Choosing this part is ideal for high-value equipment that requires a 10-15 year service life. It is a drop-in high-performance solution for existing Virtex-4 sockets that need better timing performance than the standard grade.


    Приложения

    • High-End Industrial Control: Multi-axis robotics and motion control.

    • Signal Intelligence: Real-time data encryption and high-bandwidth filtering.

    • Медицинская визуализация: Complex image reconstruction and ultrasound signal processing.

    • Test & Measurement: High-speed logic analyzers and automated test equipment (ATE).