| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-L2FFG676E | SoC Zynq-7000 | 0,00 | 0,00 | 350 000 LE | 20117760 | 250 | 0,97 – 1,03 V | Montaje en superficie | 0 °C — 100 °C | FFG-676 / FCBGA-676 | 676-FCBGA |
XC7Z045-L2FFG676E
Fabricante: Xilinx
Células lógicas: ~53 200 (versión de bajo consumo)
RAM integrada (eRAM): ~2,2 MB
Recuento de E/S: ~676 pines
Paquete: FFG?676
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
Part Number Description
This is a low-power wide-temperature heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 family, fabricated on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and Kintex-7 large-scale FPGA fabric, tailored for rugged industrial, automotive, portable field and airborne embedded devices that demand low power consumption and wide temperature adaptability.
- XC7Z045: Flagship high-capacity model of Zynq-7000 series, equipped with Kintex-grade programmable logic resources
- L2: Low-power optimized speed grade 2 (2LI). The core internal voltage is reduced to 0.95V to cut static and dynamic power consumption significantly, while maintaining timing performance equivalent to standard -2 speed grade; the maximum processor frequency is locked at 800MHz under low-power configuration
- FFG676: 676-ball flip-chip FCBGA compact package, overall dimension 27mm × 27mm, ball pitch 1.0mm
- E: Extended industrial temperature grade, junction temperature operating range: 0°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor with CoreSight debug architecture, maximum operating frequency 800MHz
- Each core features independent 32KB instruction L1 cache and 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point accelerator for digital signal computation, multimedia decoding and algorithm preprocessing
- On-chip 256KB on-chip memory (OCM); supports external DDR3 memory expansion
- Rich built-in peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC interface, dual CAN 2.0B controllers, UART, SPI, I2C, general-purpose MIO GPIO
- Secure boot with 256-bit AES encryption and SHA-256 integrity verification, preventing firmware tampering
2. Programmable Logic (PL: Kintex-7 FPGA Fabric)
- Total Logic Cells: 354,560
- DSP48E1 dedicated arithmetic slices: 1920 units, applicable to large-scale FFT, digital filtering, wireless baseband signal processing, multi-channel image algorithm acceleration and matrix computing tasks
- Total Block RAM capacity: 19.2 Mb
- Multiple MMCM and PLL clock management tiles to generate multi-group reference clocks and suppress clock jitter
- 16 channels of GTX high-speed serial transceivers, maximum line rate up to 6.25Gbps, compatible with PCIe Gen2, CPRI, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable PL user I/O pins: 360
- I/O bank voltage adjustable between 1.2V and 3.3V, supporting LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time monitoring of internal junction temperature, all power supply voltages and external analog input signals
Power Supply Specifications
- Standard core internal voltage: 1.0V
- Low-power operating voltage: 0.95V, effectively lowering overall power consumption under light and medium workloads
- Independent isolated power domains are assigned separately for PS processor section and PL FPGA logic section
- Typical total power consumption: 9W ~ 27W; passive heat sinks can fulfill long-term stable operation requirements for compact battery-powered embedded equipment
Packaging & SMT Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental & Reliability Performance
The chip can operate continuously and stably under temperature fluctuations and moderate electromagnetic interference in industrial environments.
It supports AES bitstream encryption protection and SEU single-event upset error detection, with high reliability for outdoor industrial control equipment, automotive electronic systems, handheld precision measuring instruments and lightweight airborne electronic devices requiring low power consumption and wide-temperature working conditions.
Escenarios típicos de aplicación
- Outdoor rugged industrial motion controllers, field environmental monitoring edge gateway terminals
- Vehicular multi-channel data recorders, automotive ADAS auxiliary video preprocessing modules
- Handheld portable signal analyzers, field vibration and environmental parameter acquisition instruments
- Miniature short-range radar signal preprocessing and peripheral control boards
- Portable field industrial machine vision inspection equipment
- Extended-temperature industrial low-power SOM core modules and battery-powered embedded algorithm verification platforms
