| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-L2FFG676E | Bộ xử lý hệ thống (SoC) Zynq-7000 | 0,00 | 0,00 | 350.000 LE | 20117760 | 250 | 0,97 – 1,03 V | Lắp đặt bề mặt | 0 °C — 100 °C | FFG-676 / FCBGA-676 | 676-FCBGA |
XC7Z045-L2FFG676E
Nhà sản xuất: Xilinx
Tế bào logic: ~53,200 (Low Power Version)
Bộ nhớ RAM tích hợp (eRAM): ~2,2 MB
Số lượng I/O: ~676 lượt ghim
Gói: FFG?676
Nhiệt độ hoạt động: Thương mại (0°C đến +85°C)
Thông số kỹ thuật
Part Number Description
This is a low-power wide-temperature heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 family, fabricated on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and Kintex-7 large-scale FPGA fabric, tailored for rugged industrial, automotive, portable field and airborne embedded devices that demand low power consumption and wide temperature adaptability.
- XC7Z045: Flagship high-capacity model of Zynq-7000 series, equipped with Kintex-grade programmable logic resources
- L2: Low-power optimized speed grade 2 (2LI). The core internal voltage is reduced to 0.95V to cut static and dynamic power consumption significantly, while maintaining timing performance equivalent to standard -2 speed grade; the maximum processor frequency is locked at 800MHz under low-power configuration
- FFG676: 676-ball flip-chip FCBGA compact package, overall dimension 27mm × 27mm, ball pitch 1.0mm
- E: Extended industrial temperature grade, junction temperature operating range: 0°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Hệ thống xử lý (PS: Hệ thống con ARM)
- Dual-core ARM Cortex-A9 MPCore processor with CoreSight debug architecture, maximum operating frequency 800MHz
- Each core features independent 32KB instruction L1 cache and 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point accelerator for digital signal computation, multimedia decoding and algorithm preprocessing
- On-chip 256KB on-chip memory (OCM); supports external DDR3 memory expansion
- Rich built-in peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC interface, dual CAN 2.0B controllers, UART, SPI, I2C, general-purpose MIO GPIO
- Secure boot with 256-bit AES encryption and SHA-256 integrity verification, preventing firmware tampering
2. Programmable Logic (PL: Kintex-7 FPGA Fabric)
- Total Logic Cells: 354,560
- DSP48E1 dedicated arithmetic slices: 1920 units, applicable to large-scale FFT, digital filtering, wireless baseband signal processing, multi-channel image algorithm acceleration and matrix computing tasks
- Total Block RAM capacity: 19.2 Mb
- Multiple MMCM and PLL clock management tiles to generate multi-group reference clocks and suppress clock jitter
- 16 channels of GTX high-speed serial transceivers, maximum line rate up to 6.25Gbps, compatible with PCIe Gen2, CPRI, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable PL user I/O pins: 360
- I/O bank voltage adjustable between 1.2V and 3.3V, supporting LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time monitoring of internal junction temperature, all power supply voltages and external analog input signals
Thông số kỹ thuật bộ nguồn
- Standard core internal voltage: 1.0V
- Low-power operating voltage: 0.95V, effectively lowering overall power consumption under light and medium workloads
- Independent isolated power domains are assigned separately for PS processor section and PL FPGA logic section
- Typical total power consumption: 9W ~ 27W; passive heat sinks can fulfill long-term stable operation requirements for compact battery-powered embedded equipment
Yêu cầu về đóng gói và lắp ráp SMT
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Hiệu suất về môi trường và độ tin cậy
The chip can operate continuously and stably under temperature fluctuations and moderate electromagnetic interference in industrial environments.
It supports AES bitstream encryption protection and SEU single-event upset error detection, with high reliability for outdoor industrial control equipment, automotive electronic systems, handheld precision measuring instruments and lightweight airborne electronic devices requiring low power consumption and wide-temperature working conditions.
Các tình huống ứng dụng điển hình
- Outdoor rugged industrial motion controllers, field environmental monitoring edge gateway terminals
- Vehicular multi-channel data recorders, automotive ADAS auxiliary video preprocessing modules
- Handheld portable signal analyzers, field vibration and environmental parameter acquisition instruments
- Miniature short-range radar signal preprocessing and peripheral control boards
- Portable field industrial machine vision inspection equipment
- Extended-temperature industrial low-power SOM core modules and battery-powered embedded algorithm verification platforms
