| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-3FFG901E | Kintex-7 | 37.325,00 | -3,00 | 477,760 | 35205120 | 380 | 0.97 - 1.03 | Montaje en superficie | 0 °C ... +100 °C (E) | FCBGA-901 (FFG901) | 901-FCBGA (31×31 |
XC7K480T-3FFG901E
Fabricante: Xilinx
Células lógicas: 477,760
Rebanadas lógicas: 74,650
RAM integrada (eRAM): 33 840 Kb (940 × 36 Kb de RAM en bloques)
E/S máxima por usuario: 400
Paquete: FFG901 (BGA con chip invertido)
Grado de velocidad: -3
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Definición del número de pieza
This extended temperature high-performance FPGA belongs to Xilinx Kintex-7 family, fabricated on mature 28nm HKMG high-k metal gate process with unified 7-series optimized architecture. It delivers balanced logic capacity, digital signal processing performance, high-speed serial bandwidth and cost efficiency, targeted at stationary indoor communication equipment, laboratory signal testing instruments, video processing platforms and wired transmission devices operating under stable ambient temperature conditions.
- XC7K480T: Flagship large-capacity model of Kintex-7 lineup, positioned for mid-to-high throughput digital system design, striking the optimal balance between performance, power consumption and overall cost
- -3: Speed Grade 3, the highest timing performance grade for extended temperature variants. It supports maximum achievable operating clock frequency and superior timing closure for high-speed, high-throughput digital designs with stringent timing constraints
- FFG901: 901-ball flip-chip FCBGA surface-mount package, compact outline with excellent thermal dissipation and signal integrity; abundant pins fully accommodate all integrated GTX transceivers, general-purpose I/O circuits and multi-channel DDR3 memory interfaces
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
Parámetros de los recursos de hardware integrados en el chip
1. Recursos de lógica programable
- Total System Logic Cells: 480,960
- Configurable CLB Slices: 74,650
- Total Flip-Flops: 1,493,000
- Total LUT Lookup Tables: 746,500
- Distributed RAM Capacity: 6,788 Kb
2. Recursos aritméticos y de memoria integrada
- DSP48E1 arithmetic slices: 1,920 units, dedicated to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless baseband signal processing, radar echo decoding and cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 34,380 Kb, utilized for image frame buffering, deep FIFO data caching, waveform raw data storage and algorithm parameter lookup tablesAMD
3. Subsistema de gestión del reloj
- 12 bloques de gestión de reloj MMCM
- 12 PLL phase-locked loops
Multiple mutually independent clock domains can be freely configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low jitter suppression, fully meeting strict synchronous timing requirements of large-scale communication and digital signal processing systems
4. Transceptores seriales de alta velocidad
- 32 GTX differential high-speed transceivers
Each lane supports maximum transmission rate of 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial serial communication protocols. Integrated hard protocol controllers greatly shorten the development cycle of high-bandwidth data transmission interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 400
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards
El módulo de monitoreo del sistema XADC integrado recopila continuamente datos en tiempo real sobre la temperatura de unión del chip, los voltajes de alimentación internos del núcleo y las señales de entrada analógicas externas
Características de la fuente de alimentación
Core operating voltage for Speed Grade 3 ranges from 1.00V to 1.05V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power gating to dynamically adjust overall power consumption
Typical total power consumption ranges from 18W to 46W. For stable full-load continuous operation at the upper extended temperature limit, forced air cooling configuration is required
Especificaciones de empaque y ensamblaje SMT
- Package form: 901-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
- Diseño de empaques sin plomo, que cumple plenamente con las normas ambientales de la Directiva RoHS
- Chips are stored and transported in anti-static trays to prevent electrostatic damage during mass PCB assembly production
Adaptabilidad ambiental y confiabilidad operativa
This chip is customized for indoor constant-temperature working environments. It runs reliably for long durations under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction, without radiation-hardened reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged application scenarios
Escenarios típicos de aplicación
- 10G/40G optical communication line cards, enterprise network switching and routing processing boards deployed in server rooms
- Desktop ultra-wideband spectrum analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments for laboratories
- 4K real-time video encoding/decoding equipment, industrial machine vision high-resolution image processing platforms
- Medium-scale communication chip prototype verification and algorithm development platforms for universities and research institutes
- Indoor industrial high-speed data gateways and desktop cryptographic acceleration hardware
