xc7k480t-3ffg901e

تعريف رقم القطعة

1. XC7K480T: Flagship large-capacity model of Kintex-7 lineup, positioned for mid-to-high throughput digital system design, striking the optimal balance between performance, power consumption and overall cost
2. -3: Speed Grade 3, the highest timing performance grade for extended temperature variants. It supports maximum achievable operating clock frequency and superior timing closure for high-speed, high-throughput digital designs with stringent timing constraints
3. FFG901: 901-ball flip-chip FCBGA surface-mount package, compact outline with excellent thermal dissipation and signal integrity; abundant pins fully accommodate all integrated GTX transceivers, general-purpose I/O circuits and multi-channel DDR3 memory interfaces
4. E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C

معلمات موارد الأجهزة المدمجة في الرقاقة

1. Programmable Logic Resources

• Total System Logic Cells: 480,960
• Configurable CLB Slices: 74,650
• Total Flip-Flops: 1,493,000
• Total LUT Lookup Tables: 746,500
• Distributed RAM Capacity: 6,788 Kb

2. موارد الحساب والذاكرة المدمجة

• DSP48E1 arithmetic slices: 1,920 units, dedicated to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless baseband signal processing, radar echo decoding and cryptographic algorithm acceleration tasks
• Total Block RAM Capacity: 34,380 Kb, utilized for image frame buffering, deep FIFO data caching, waveform raw data storage and algorithm parameter lookup tablesAMD

3. Clock Management Subsystem

• 12 وحدة إدارة التوقيت من نوع MMCM
• 12 PLL phase-locked loops

  Multiple mutually independent clock domains can be freely configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low jitter suppression, fully meeting strict synchronous timing requirements of large-scale communication and digital signal processing systems

4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة

• 32 GTX differential high-speed transceivers

  Each lane supports maximum transmission rate of 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial serial communication protocols. Integrated hard protocol controllers greatly shorten the development cycle of high-bandwidth data transmission interfaces

5. I/O Interfaces and System Monitoring Module

• Configurable user I/O pins: 400

  Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards

  Embedded XADC system monitoring module continuously collects real-time data of chip junction temperature, internal core supply voltages and external analog input signals

Power Supply Characteristics

Packaging and SMT Assembly Specifications

• Package form: 901-pin FCBGA flip-chip ball grid array
• Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
• Lead-free packaging design, fully compliant with RoHS environmental standards
• Chips are stored and transported in anti-static trays to prevent electrostatic damage during mass PCB assembly production

Environmental Adaptability and Operational Reliability

سيناريوهات التطبيق النموذجية

1. 10G/40G optical communication line cards, enterprise network switching and routing processing boards deployed in server rooms
2. Desktop ultra-wideband spectrum analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments for laboratories
3. 4K real-time video encoding/decoding equipment, industrial machine vision high-resolution image processing platforms
4. Medium-scale communication chip prototype verification and algorithm development platforms for universities and research institutes
5. Indoor industrial high-speed data gateways and desktop cryptographic acceleration hardware