| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-3FFG901E | Kintex-7 | 37.325,00 | -3,00 | 477,760 | 35205120 | 380 | 0.97 - 1.03 | Pemasangan di Permukaan | 0 °C ... +100 °C (E) | FCBGA-901 (FFG901) | 901-FCBGA (31×31 |
XC7K480T-3FFG901E
Produsen: Xilinx
Sel Logika: 477,760
Irisan Logika: 74,650
RAM tertanam (eRAM): 33.840 Kb (940 × 36Kb Blok RAM)
I/O Pengguna Maksimum: 400
Paket: FFG901 (Flip-Chip BGA)
Tingkat Kecepatan: -3
Suhu Pengoperasian: Diperpanjang (0°C hingga +100°C)
Spesifikasi
Definisi Nomor Bagian
This extended temperature high-performance FPGA belongs to Xilinx Kintex-7 family, fabricated on mature 28nm HKMG high-k metal gate process with unified 7-series optimized architecture. It delivers balanced logic capacity, digital signal processing performance, high-speed serial bandwidth and cost efficiency, targeted at stationary indoor communication equipment, laboratory signal testing instruments, video processing platforms and wired transmission devices operating under stable ambient temperature conditions.
- XC7K480T: Flagship large-capacity model of Kintex-7 lineup, positioned for mid-to-high throughput digital system design, striking the optimal balance between performance, power consumption and overall cost
- -3: Speed Grade 3, the highest timing performance grade for extended temperature variants. It supports maximum achievable operating clock frequency and superior timing closure for high-speed, high-throughput digital designs with stringent timing constraints
- FFG901: 901-ball flip-chip FCBGA surface-mount package, compact outline with excellent thermal dissipation and signal integrity; abundant pins fully accommodate all integrated GTX transceivers, general-purpose I/O circuits and multi-channel DDR3 memory interfaces
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 480,960
- Configurable CLB Slices: 74,650
- Total Flip-Flops: 1,493,000
- Total LUT Lookup Tables: 746,500
- Distributed RAM Capacity: 6,788 Kb
2. Arithmetic and Embedded Memory Resources
- DSP48E1 arithmetic slices: 1,920 units, dedicated to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless baseband signal processing, radar echo decoding and cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 34,380 Kb, utilized for image frame buffering, deep FIFO data caching, waveform raw data storage and algorithm parameter lookup tablesAMD
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Multiple mutually independent clock domains can be freely configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low jitter suppression, fully meeting strict synchronous timing requirements of large-scale communication and digital signal processing systems
4. High-Speed Serial Transceivers
- 32 GTX differential high-speed transceivers
Each lane supports maximum transmission rate of 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial serial communication protocols. Integrated hard protocol controllers greatly shorten the development cycle of high-bandwidth data transmission interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 400
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards
Embedded XADC system monitoring module continuously collects real-time data of chip junction temperature, internal core supply voltages and external analog input signals
Power Supply Characteristics
Core operating voltage for Speed Grade 3 ranges from 1.00V to 1.05V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power gating to dynamically adjust overall power consumption
Typical total power consumption ranges from 18W to 46W. For stable full-load continuous operation at the upper extended temperature limit, forced air cooling configuration is required
Packaging and SMT Assembly Specifications
- Package form: 901-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to prevent electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
This chip is customized for indoor constant-temperature working environments. It runs reliably for long durations under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction, without radiation-hardened reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged application scenarios
Skenario Aplikasi Umum
- 10G/40G optical communication line cards, enterprise network switching and routing processing boards deployed in server rooms
- Desktop ultra-wideband spectrum analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments for laboratories
- 4K real-time video encoding/decoding equipment, industrial machine vision high-resolution image processing platforms
- Medium-scale communication chip prototype verification and algorithm development platforms for universities and research institutes
- Indoor industrial high-speed data gateways and desktop cryptographic acceleration hardware
