| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-3FFG901E | Kintex-7 | 37.325,00 | -3,00 | 477,760 | 35205120 | 380 | 0,97 – 1,03 | Lắp đặt bề mặt | 0 °C … +100 °C (E) | FCBGA-901 (FFG901) | 901-FCBGA (31×31 |
XC7K480T-3FFG901E
Nhà sản xuất: Xilinx
Tế bào logic: 477,760
Các lát cắt logic: 74,650
Bộ nhớ RAM tích hợp (eRAM): 33.840 Kb (940 × 36 Kb bộ nhớ RAM khối)
Dung lượng I/O tối đa của người dùng: 400
Gói: FFG901 (BGA lật chip)
Đánh giá tốc độ: -3
Nhiệt độ hoạt động: Mở rộng (0°C đến +100°C)
Thông số kỹ thuật
Định nghĩa mã sản phẩm
This extended temperature high-performance FPGA belongs to Xilinx Kintex-7 family, fabricated on mature 28nm HKMG high-k metal gate process with unified 7-series optimized architecture. It delivers balanced logic capacity, digital signal processing performance, high-speed serial bandwidth and cost efficiency, targeted at stationary indoor communication equipment, laboratory signal testing instruments, video processing platforms and wired transmission devices operating under stable ambient temperature conditions.
- XC7K480T: Flagship large-capacity model of Kintex-7 lineup, positioned for mid-to-high throughput digital system design, striking the optimal balance between performance, power consumption and overall cost
- -3: Speed Grade 3, the highest timing performance grade for extended temperature variants. It supports maximum achievable operating clock frequency and superior timing closure for high-speed, high-throughput digital designs with stringent timing constraints
- FFG901: 901-ball flip-chip FCBGA surface-mount package, compact outline with excellent thermal dissipation and signal integrity; abundant pins fully accommodate all integrated GTX transceivers, general-purpose I/O circuits and multi-channel DDR3 memory interfaces
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
Các tham số tài nguyên phần cứng trên chip
1. Tài nguyên về logic lập trình
- Total System Logic Cells: 480,960
- Configurable CLB Slices: 74,650
- Total Flip-Flops: 1,493,000
- Total LUT Lookup Tables: 746,500
- Distributed RAM Capacity: 6,788 Kb
2. Các tài nguyên toán học và bộ nhớ nhúng
- DSP48E1 arithmetic slices: 1,920 units, dedicated to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless baseband signal processing, radar echo decoding and cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 34,380 Kb, utilized for image frame buffering, deep FIFO data caching, waveform raw data storage and algorithm parameter lookup tablesAMD
3. Hệ thống con quản lý đồng hồ
- 12 khối quản lý đồng hồ MMCM
- 12 PLL phase-locked loops
Multiple mutually independent clock domains can be freely configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low jitter suppression, fully meeting strict synchronous timing requirements of large-scale communication and digital signal processing systems
4. Bộ thu phát nối tiếp tốc độ cao
- 32 GTX differential high-speed transceivers
Each lane supports maximum transmission rate of 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial serial communication protocols. Integrated hard protocol controllers greatly shorten the development cycle of high-bandwidth data transmission interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 400
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards
Mô-đun giám sát hệ thống XADC nhúng liên tục thu thập dữ liệu thời gian thực về nhiệt độ mối nối chip, điện áp cấp nguồn lõi bên trong và các tín hiệu đầu vào tương tự bên ngoài
Đặc tính của bộ nguồn
Core operating voltage for Speed Grade 3 ranges from 1.00V to 1.05V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power gating to dynamically adjust overall power consumption
Typical total power consumption ranges from 18W to 46W. For stable full-load continuous operation at the upper extended temperature limit, forced air cooling configuration is required
Thông số kỹ thuật về đóng gói và lắp ráp SMT
- Package form: 901-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
- Thiết kế bao bì không chứa chì, hoàn toàn tuân thủ các tiêu chuẩn môi trường RoHS
- Chips are stored and transported in anti-static trays to prevent electrostatic damage during mass PCB assembly production
Khả năng thích ứng với môi trường và độ tin cậy trong vận hành
This chip is customized for indoor constant-temperature working environments. It runs reliably for long durations under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction, without radiation-hardened reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged application scenarios
Các tình huống ứng dụng điển hình
- 10G/40G optical communication line cards, enterprise network switching and routing processing boards deployed in server rooms
- Desktop ultra-wideband spectrum analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments for laboratories
- 4K real-time video encoding/decoding equipment, industrial machine vision high-resolution image processing platforms
- Medium-scale communication chip prototype verification and algorithm development platforms for universities and research institutes
- Indoor industrial high-speed data gateways and desktop cryptographic acceleration hardware







