XC5VFX130T-2FF1738I

Fabricante: Xilinx Células lógicas: 130,560 Rebanadas lógicas: 20,480 RAM integrada (eRAM): 6,048 Kb (336 × 18Kb Block RAM) Paquete: FF1738 (Flip-Chip BGA) Temperatura de funcionamiento: Industrial (-40°C a +100°C)

ENVÍANOS UN MENSAJE

    Especificaciones

    MODELO P/NSERIENÚMERO DE LABORATORIOS/CLBSGRADO DE VELOCIDADNÚMERO DE ELEMENTOS LÓGICOS / CELDASTOTAL BITS RAMNÚMERO DE E/STENSIÓN - ALIMENTACIÓNTIPO DE MONTAJETEMPERATURA DE FUNCIONAMIENTOPAQUETE / ESTUCHEPAQUETE DEL DISPOSITIVO DEL PROVEEDOR
    XC5VFX130T-2FF1738IVirtex-5 FXT10.240,00-2,00131072109854728400,95 V-1,05 VMontaje en superficie-40 °C ~ +100 °C1738-FBGA, FCBGA1738-FCPBGA (42.5×42.5 mm)

    Xilinx XC5VFX130T-2FF1738I | Virtex-5 FXT Industrial Grade High-Performance FPGA

    En XC5VFX130T-2FF1738I is a flagship FPGA engineered for ultra-demanding industrial and mission-critical systems. This device represents the high-performance tier of the Virtex-5 FXT family, combining -2 grado de velocidad efficiency with a rugged Industrial temperature rating (-40°C to +100°C). With dual PowerPC® 440 cores and 20 high-speed GTX transceivers, it provides a robust platform for complex data-path acceleration in harsh environments.

    En LXB Semicon, we specialize in high-value, high-reliability Xilinx silicon, providing fully verified and traceable XC5VFX130T-2FF1738I units to our global partners.

    Especificaciones técnicas básicas

    The XC5VFX130T is one of the largest devices in the FXT sub-family, optimized for maximum I/O and processing density:

    CaracterísticaEspecificación detallada
    Células lógicas131,072
    Grado de velocidad-2 (Enhanced Performance)
    Temperatura de funcionamiento-40°C a +100°C (grado industrial)
    Embedded Processors2 x PowerPC® 440 Blocks
    RocketIO™ GTX20 Transceivers (supporting up to 6.5 Gbps)
    Lonchas DSP48E320
    Max User I/O840
    PaqueteFF1738 (1738-pin Flip-Chip BGA)

    Why the “2I” Configuration is Critical for Your Design

    For systems operating at the edge of performance and environmental limits, the XC5VFX130T-2FF1738I offers distinct advantages:

    1. Industrial-Grade Thermal Resilience

    En -I rating ensures that the FPGA maintains timing closure and logic stability under extreme cold and heat (-40°C to +100°C). This is a non-negotiable requirement for outdoor telecom infrastructure, avionics, and heavy industrial automation.

    2. Superior Timing with -2 Speed Grade

    En -2 grado de velocidad provides faster clock speeds and lower propagation delays than the standard -1 grade. In a design utilizing over 130k logic cells, this extra margin is often the difference between a system that meets its timing constraints and one that requires costly redesign.

    3. Massive Processor & I/O Density

    The integration of dual PowerPC cores allows for sophisticated hardware/software partitioning. Combined with 840 user I/Os, this chip can act as a centralized controller for massive sensor arrays or complex backplane communication systems.

    4. Legacy Reliability in FF1738 Package

    The large 1738-pin package is designed for maximum signal grounding and thermal dissipation, ensuring high signal integrity (SI) for the 20 GTX transceivers operating at multi-gigabit speeds.


    High-Value Applications

    • Defense & Aerospace: Radar signal processing and ruggedized mission computers.

    • Energy & Infrastructure: Smart grid protection systems and power station monitoring.

    • Telecommunications: High-capacity base stations and core optical networking.

    • Specialized Computing: Hardware-in-the-loop (HIL) simulators and financial modeling accelerators.


    The LXB Semicon Assurance: Quality & Traceability 

    When procuring a high-value component like the XC5VFX130T-2FF1738I, the pedigree of the supplier is paramount. LXB Semicon ensures your investment is protected:

    • Authenticity Guaranteed: Every component is 100% original Xilinx (now AMD) silicon. We provide thorough incoming inspections to ensure factory-new condition.

    • Industrial Traceability: We provide Date Code (D/C) and Lot Code information, supporting the strict documentation requirements of industrial and military-grade procurement.

    • Expert Handling: Large BGA packages like the 1738 are sensitive to moisture and ESD. We use vacuum-sealed, moisture-barrier packaging and strict ESD protocols to ensure the integrity of the BGA balls and the silicon.

    • Longevity Support: We maintain stock for legacy Virtex-5 parts to help our clients avoid the risks of EOL (End-of-Life) components and production delays.


    Preguntas más frecuentes (FAQ)

    Q: Can I use the XC5VFX130T-2FF1738I to replace a commercial grade -1 part?

    A: Yes. The -2I version is an “up-grade” that covers the commercial temperature range and exceeds the performance of a -1 speed grade. It is a robust drop-in replacement.

    Q: What software is required to program this device?

    A: This FPGA is supported by Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.

    Q: Does the “FF1738” package contain lead?

    A: Yes, the FF1738 package is a standard leaded BGA. If your project requires a lead-free solution, you should look for the FFG1738 (with the ‘G’ suffix).


    Secure Your Supply of XC5VFX130T-2FF1738I

    Looking for a bulk quote or have technical questions? Contact LXB Semicon today for current availability and competitive pricing.