XC5VFX130T-2FF1738I

Üretici firma: Xilinx Mantık Hücreleri: 130,560 Mantık Dilimleri: 20,480 Gömülü RAM (eRAM): 6.048 Kb (336 × 18Kb Blok RAM) Paket: FF1738 (Flip-Chip BGA) Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC5VFX130T-2FF1738I Virtex-5 FXT 10.240,00 -2,00 131072 10985472 840 0,95 V-1,05 V Yüzey Montajı -40 °C ~ +100 °C 1738-FBGA, FCBGA 1738-FCPBGA (42,5×42,5 mm)

    Xilinx XC5VFX130T-2FF1738I | Virtex-5 FXT Industrial Grade High-Performance FPGA

    Bu XC5VFX130T-2FF1738I is a flagship FPGA engineered for ultra-demanding industrial and mission-critical systems. This device represents the high-performance tier of the Virtex-5 FXT family, combining -2 hız derecesi efficiency with a rugged Industrial temperature rating (-40°C to +100°C). With dual PowerPC® 440 cores and 20 high-speed GTX alıcı-vericileri, it provides a robust platform for complex data-path acceleration in harsh environments.

    At LXB Semicon, we specialize in high-value, high-reliability Xilinx silicon, providing fully verified and traceable XC5VFX130T-2FF1738I units to our global partners.

    Çekirdek Teknik Özellikler

    The XC5VFX130T is one of the largest devices in the FXT sub-family, optimized for maximum I/O and processing density:

    Özellik Detaylı Şartname
    Mantık Hücreleri 131,072
    Hız Sınıfı -2 (Enhanced Performance)
    Çalışma Sıcaklığı -40°C ila +100°C (Endüstriyel Sınıf)
    Gömülü İşlemciler 2 x PowerPC® 440 Blocks
    RocketIO™ GTX 20 Alıcı-Verici (6,5 Gbps'ye kadar destekler)
    DSP48E Dilimleri 320
    Maksimum Kullanıcı G/Ç 840
    Paket FF1738 (1738-pin Flip-Chip BGA)

    Why the “2I” Configuration is Critical for Your Design

    For systems operating at the edge of performance and environmental limits, the XC5VFX130T-2FF1738I offers distinct advantages:

    1. Industrial-Grade Thermal Resilience

    Bu -I rating ensures that the FPGA maintains timing closure and logic stability under extreme cold and heat (-40°C to +100°C). This is a non-negotiable requirement for outdoor telecom infrastructure, avionics, and heavy industrial automation.

    2. Superior Timing with -2 Speed Grade

    Bu -2 hız derecesi provides faster clock speeds and lower propagation delays than the standard -1 grade. In a design utilizing over 130k logic cells, this extra margin is often the difference between a system that meets its timing constraints and one that requires costly redesign.

    3. Massive Processor & I/O Density

    The integration of dual PowerPC cores allows for sophisticated hardware/software partitioning. Combined with 840 kullanıcı I/O'su, this chip can act as a centralized controller for massive sensor arrays or complex backplane communication systems.

    4. Legacy Reliability in FF1738 Package

    The large 1738-pin package is designed for maximum signal grounding and thermal dissipation, ensuring high signal integrity (SI) for the 20 GTX transceivers operating at multi-gigabit speeds.


    High-Value Applications

    • Savunma ve Havacılık: Radar signal processing and ruggedized mission computers.

    • Energy & Infrastructure: Smart grid protection systems and power station monitoring.

    • Telekomünikasyon: High-capacity base stations and core optical networking.

    • Specialized Computing: Hardware-in-the-loop (HIL) simulators and financial modeling accelerators.


    The LXB Semicon Assurance: Quality & Traceability 

    When procuring a high-value component like the XC5VFX130T-2FF1738I, the pedigree of the supplier is paramount. LXB Semicon ensures your investment is protected:

    • Authenticity Guaranteed: Every component is 100% original Xilinx (now AMD) silicon. We provide thorough incoming inspections to ensure factory-new condition.

    • Endüstriyel İzlenebilirlik: We provide Date Code (D/C) and Lot Code information, supporting the strict documentation requirements of industrial and military-grade procurement.

    • Expert Handling: Large BGA packages like the 1738 are sensitive to moisture and ESD. We use vacuum-sealed, moisture-barrier packaging and strict ESD protocols to ensure the integrity of the BGA balls and the silicon.

    • Longevity Support: We maintain stock for legacy Virtex-5 parts to help our clients avoid the risks of EOL (End-of-Life) components and production delays.


    Sıkça Sorulan Sorular (SSS)

    Q: Can I use the XC5VFX130T-2FF1738I to replace a commercial grade -1 part?

    A: Yes. The -2I version is an “up-grade” that covers the commercial temperature range and exceeds the performance of a -1 speed grade. It is a robust drop-in replacement.

    Q: What software is required to program this device?

    A: This FPGA is supported by Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.

    Q: Does the “FF1738” package contain lead?

    A: Yes, the FF1738 package is a standard leaded BGA. If your project requires a lead-free solution, you should look for the FFG1738 (with the ‘G’ suffix).


    Secure Your Supply of XC5VFX130T-2FF1738I

    Looking for a bulk quote or have technical questions? Contact LXB Semicon today for current availability and competitive pricing.